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Apparatus and methods for spectrum based monitoring of chemical mechanical polishing

An optical head, polishing pad technology, applied in the directions of grinding devices, chemical instruments and methods, grinding/polishing safety devices, etc.

Active Publication Date: 2009-03-25
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the end point of grinding cannot be judged only as a function of grinding time

Method used

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  • Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
  • Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
  • Apparatus and methods for spectrum based monitoring of chemical mechanical polishing

Examples

Experimental program
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Embodiment Construction

[0074] figure 1 Grinding equipment 20 that can be used to grind a substrate 10 is identified. The grinding device 20 includes a rotatable disc platform 24 on which a grinding pad 30 is disposed. The platform is rotatable about axis 25 . For example, a motor can turn a drive rod 22 to rotate the platform 24 . The polishing pad 30 can be removably secured to the platform 24, for example, with a layer of adhesive. When exhausted, the abrasive pad 30 can be removed and replaced. The polishing pad 30 may be a two-layer polishing pad having an outer abrasive layer 32 and a softer back abrasive layer 34 .

[0075] Optical access 36 through the polishing pad is provided by including a hole (ie, a hole through the polishing pad) or a solid window. The rigid window can be affixed to the polishing pad, although in some implementations the rigid window can be supported on the platform 24 and protrude into holes in the polishing pad. The polishing pad 30 is generally placed on the pl...

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PUM

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Abstract

Apparatus and methods for spectrum based monitoring of chemical mechanical polishing, including spectrum based endpointing, spectrum based polishing rate adjustment, flushing a top surface of an optical head, or a pad with a window. The spectrum-based endpointing uses a reference spectrum which is empirically selected for particular spectrum based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum based endpoint logic. The polishing endpoint can be determined using a difference trace or a sequence of index values. The flushing system creates a laminar gas flow across the top surface of the optical head. The vacuum nozzle and vacuum sources are configured so that the flow if gas is laminar. The window includes a soft plastic portion and a crystalline or glass like portion. The spectrum based polishing rate adjustment includes obtaining spectra for different zones on a substrate.

Description

[0001] This application is a divisional application of the patent application entitled "Spectrum-Based Monitoring Chemical Mechanical Polishing Device and Method" filed on August 21, 2006 with the application number "200680030404.9". technical field [0002] The present invention generally relates to chemical mechanical polishing of substrates. Background technique [0003] An integrated circuit is typically formed on a substrate by the deposition of a series of conductive, semiconducting, or insulating layers on a silicon wafer. A fabrication step includes depositing a fill layer on a non-planar surface and planarizing the fill layer. For some applications, planarization of the fill layer continues until the top surface of a patterned layer is exposed. A conductive fill layer, for example, may be deposited on a patterned insulating layer to fill trenches or holes in the insulating layer. After planarization, the portions of the conductive layer remaining between the raise...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04B24B49/12H01L21/304B24B55/00B08B5/02
CPCB24B49/12B24B49/08H01L22/26H01L21/31053B24D7/14B24B37/205H01L21/3212B24B37/013B24B37/34H01L21/30625H01L21/31055H01L21/67075H01L21/67092H01L21/67253
Inventor D·J·本韦格努J·D·戴维B·斯韦德克H·Q·李L·卡鲁皮亚
Owner APPLIED MATERIALS INC
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