Micro-electroforming apparatus

Abstract

The invention relates to a micro-electroforming device which comprises a cathode clamp, a cathode, an electroforming solution stirring pipe, a solution inlet, electric field distribution baffles, electric field distribution baffle positioning baffles, a solution outlet, an anode and a micro-electroforming bath. The anode and the cathode clamp are vertically arranged on the side surfaces of the micro-electroforming bath and face to each other; the cathode is arranged in the cathode clamp; the side plate of the micro-electroforming bath is provided with positioning baffles used for fixing the anode and the cathode clamp as well as a plurality of electric field distribution baffle positioning baffles; the electric field distribution baffles are arranged between the anode and the cathode; thesolution inlet is arranged below the side plate adjacent to the cathode; the electroforming solution stirring pipe is arranged right below the cathode and connected with the solution inlet. The solution outlet is arranged above the side plate adjacent to the anode. A plurality of sets of electric field distribution baffles in concentric circles as well as the circular auxiliary cathode before or on the front side of the cathode clamp make sure the electric fields are evenly distributed on a wafer, which realizes even thickness of MEMS device microstructure layers, convenient operation and high practicality.

Description

technical field [0001] The invention relates to a device in the technical field of micro-electromechanical systems (MEMS), in particular to a micro-electroforming device. Background technique [0002] Various micro devices that are small in size, light in weight, low in energy consumption and easy to mass-produce can be obtained by using MEMS (Micro Electro Mechanical Systems) technology. Among them, the LIGA (abbreviation of German Lithographie, Galvanoformung and Abformung) technology developed by Germany as a representative is a process technology that uses photolithography masks and electrochemical methods to realize the manufacture of three-dimensional non-silicon complex microstructures. It can be seen that micro-electroforming (plating) technology has become one of the key process technologies in the MEMS field. The basic principle of electroforming is the same as that of electroplating, which is based on electrochemical reactions. The biggest difference is the diffe...

AI Technical Summary

Problems solved by technology

However, this kind of device is very cumbersome to install and hang when it is necessary to monitor the thickness of the coating and perform multiple tests during the electroplating process, and it is inconvenient to operate.

Moreover, since the electric field distribution on the wafer is not considered, and the necessary auxiliary structures are introduced, it is difficult to solve the uniformity of the device microstructure on the wafer.

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