Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High cooling circuit board and preparation thereof

A manufacturing method and circuit board technology, which is applied in the direction of circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve the problems of affecting thermal conductivity and poor thermal conductivity of resin substrates, etc.

Inactive Publication Date: 2008-12-10
E HENG TECH
View PDF12 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, the current heat dissipation method of the circuit board is to join the metal plate under the resin substrate to enhance the effect. This method has the following disadvantages: (1) The thermal conductivity of the resin substrate is not good; (2) The bonding method between the resin substrate and the heat dissipation metal It will also affect the thermal conductivity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High cooling circuit board and preparation thereof
  • High cooling circuit board and preparation thereof
  • High cooling circuit board and preparation thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] In order to make those familiar with the art understand the purpose, characteristics and effects of the present invention, the following specific examples are used to illustrate this creation in detail, as follows:

[0034] Please refer to figure 2 , illustrating a schematic structural view of the high heat dissipation circuit board of the present invention, the high heat dissipation circuit board 2 includes: at least one metal substrate 21; an insulating layer 23, the insulating layer 23 is an insulating surface with thermal conductivity, to implant conductive lines; And a buffer layer 22, the buffer layer 22 is interposed between the metal substrate 21 and the insulating layer 23, so as to improve the joint adhesion between the metal substrate 21 and the insulating layer 23, and reduce the peeling or peeling of the plating due to thermal stress. phenomenon of rupture.

[0035] Please refer to image 3 , illustrating the flow chart of the manufacturing method of the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to a high radiating circuit board and production thereof. A metal material is mainly taken as a substrate. The surface of the metal substrate is provided with a buffer layer. An insulating layer is formed on the surface of the buffer layer. The buffer layer can improve adhesiveness between the metal substrate and the insulating layer, and reduce thermal stress simultaneously. The insulating layer provides the surface insulativity required by implanting circuit and heat conducting property is provided to guide heat energy to distribute uniformly, thereby being favorable for the bottom buffer layer and the metal substrate to release heat to outside, further improving radiating efficiency of the circuit board.

Description

technical field [0001] The present invention relates to a circuit board and a manufacturing method thereof, in particular to a high heat dissipation circuit board and a manufacturing method thereof. Background technique [0002] At present, the most widely used circuit board is the printed circuit board, and its substrate materials include the following four types: (1) paper substrate; (2) composite substrate; (3) glass fiber epoxy substrate; (4) soft substrate. Among them, glass fiber epoxy substrate is the most widely used, and its material is glass fiber cloth impregnated with flame-resistant epoxy resin, commonly known as FR4 printed circuit substrate. The aforementioned circuit substrate materials are all resin and polymer materials, which have poor thermal conductivity and heat dissipation properties. For electronic components and systems with high heat generation, heat energy cannot be effectively removed. Therefore, in order to improve the heat dissipation of the su...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/00H05K7/20H05K1/05H05K3/00
Inventor 周邦彦简谷卫
Owner E HENG TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com