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Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method

A technology of LED encapsulation and inkjet printing, applied in chemical instruments and methods, luminescent materials, semiconductor devices, etc., can solve problems such as uneven thickness and structure of phosphor layers, restrictions on mass production and yield, poor repeatability of phosphor thickness, etc. , to achieve the effect of improving the structure and physical and chemical properties, and improving the overall performance

Inactive Publication Date: 2008-12-10
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this phosphor-converted white LED, the current mainstream process is to mix phosphor particles with transparent colloid (such as epoxy glue, silica gel, etc.), and apply a mixed layer of phosphor powder and colloid on the LED chip by dispensing glue. , but the thickness structure of the phosphor layer obtained in this way is not uniform, resulting in poor uniformity of LED light output, and poor repeatability of phosphor thickness between devices, which greatly restricts mass production and yield

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Take 1ml each of silica gel A and silica gel B, stir evenly to form a mixed silica gel, let stand for about 10 hours, wait for the bubbles in it to disappear completely; measure a certain amount of tetrahydrofuran organic solvent, stir to reduce the viscosity of the silica gel from about 400mPa·s. 10-12mPa.s or less; weigh 500mg of phosphor powder, mix it with the diluted mixed silica gel, and stir evenly to form a dispersion of phosphor and resin with appropriate viscosity suitable for inkjet printing; by checking the inkjet printing time , Ink jet path and other parameters are controlled to form a phosphor layer with controllable shape and thickness on the surface of the LED chip.

Embodiment 2

[0033] Take 1ml each of silica gel A and silica gel B, stir evenly to form a mixed silica gel, let stand for about 10 hours, wait for the bubbles in it to disappear completely; measure a certain amount of ethyl acetate organic solvent, stir to make the viscosity of the silica gel change from about 400mPa· s is reduced to 10-12mPa·s or less; weigh 500mg of phosphor powder, mix it with the diluted mixed silica gel, stir evenly to form a dispersion of phosphor and resin with appropriate viscosity suitable for inkjet printing; The control of parameters such as printing time and ink jet path forms a phosphor layer with controllable shape and thickness on the surface of the LED chip.

Embodiment 3

[0035] Take 1ml each of the epoxy resin and its curing agent, and mix them evenly; weigh 500mg of the phosphor powder, add it to the prepared epoxy resin, and stir evenly; measure a certain amount of tetrahydrofuran organic solvent, mix and stir to make the phosphor epoxy resin The viscosity of the dispersion is reduced to 10-12mPa·s to form a dispersion of phosphor and resin with appropriate viscosity suitable for inkjet printing, and a shape is formed on the surface of the LED chip by controlling parameters such as inkjet printing time and inkjet path. , Phosphor layer with controllable thickness.

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Abstract

The invention discloses a preparation for the fluorescent powder dispersoid for the LED package and a ink-jet printing method, comprising the following steps: (1) preparing the resin: mixing the resin and the firming agent with a proper volume proportion; (2) diluting the resin: mixing the resin with high adhesive prepared in the step (1) to the ether or ester organic solvent with proper proportion, reducing the adhesive of the resin; (3) preparing the fluorescent powder and dispersoid: mixing the fluorescent powder with the resin diluted by the step (2) with a proper proportion , dispersing evenly to form the fluorescent powder dispersoid; (4) ink-jet printing package: loading the fluorescent powder dispersoid with the qualified adhesive prepared in the step (3) in the ink-jet printing head, achieving a resin covering, which is a fluorescent powder layer, with shape and thickness controllable resin covering on the LED chip surface via the control for the ink-jet time and the ink-jet path for the ink-jet printer. The method overcomes the defects in the current packaging technology, which can effectively enhance the integral performance for the LED devices and satisfy the requests of industrialized volume-produce.

Description

Technical field [0001] The invention relates to the application field of optoelectronic technology, in particular to a method for preparing a phosphor dispersion for LED packaging and an inkjet printing method. Background technique [0002] LED is short for light emitting diode. Since the world's first red light-emitting diode came out, LED technology has undergone a rapid development process, and LEDs of various luminous colors have been born one after another. In 1993, Japan first achieved a technological breakthrough in blue GaN-LED, and realized white light LED in 1996. In recent years, the research and development of semiconductor lighting technology, the fourth generation of lighting technology represented by white light LED, has been well received all over the world. Attaches great importance. White LED has the advantages of no pollution, low power consumption, high reliability, long life, etc., and it is a green lighting source that is environmentally friendly and energy-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00C09K3/10C09K11/00
Inventor 饶海波李君飞侯斌胡玥卢志云谢明贵
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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