Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Radiation curable thermal transfer elements

A technology of radiation curing and heat transfer, which is applied in the fields of electrical components, electric solid-state devices, and the application of radiation from radioactive sources, and can solve problems such as impracticality and device difficulties.

Inactive Publication Date: 2008-10-08
3M INNOVATIVE PROPERTIES CO
View PDF50 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In some applications, it may be difficult or impractical to fabricate the devices using conventional photolithographic patterning techniques

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Radiation curable thermal transfer elements
  • Radiation curable thermal transfer elements
  • Radiation curable thermal transfer elements

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0127] An LTHC layer comprising carbon black and Prussian blue (also known as iron blue and pigment blue 27) with similar absorption at 808 nm was prepared.

[0128] Sample 1 was prepared in the following manner. Prior to application of the LTHC solution, 2.88 mil thick polyethylene terephthalate (DuPont Teijin Films, Hopewell VA) was tested using nitrogen gas at 300 watts and a line speed of 50 ft / min. The inside of the M7Q base film substrate is corona treated. A Prussian blue-based LTHC solution (non-particulate absorbing material) containing the components shown in Table I was then applied to the corona-treated processed M7Q film. To achieve a dry thickness of approximately 2.8 microns, a line speed of 20 ft / min and a 180R microgravure printing mode set at 9.0 ft / min were used. The coatings were sequentially passed into three ovens (75 / 75 / 80° C.) for in-line drying, and then dried under a 600 W / inch lamp (with a D bulb set at 70% power) by Fusion UV Systems, Inc. (Gaith...

example 2

[0136] A series of LTHC layer coatings with different pigment loadings were prepared according to the components shown in Table IV.

[0137]Sample 5 was prepared in the following manner. Prior to application of the LTHC solution, 2.88 mil thick polyethylene terephthalate (DuPont Teijin Films, Hopewell VA) was tested using nitrogen gas at 300 watts and a line speed of 50 ft / min. The inside of the M7Q base film substrate is corona treated. A Prussian blue-based LTHC solution prepared with 9S928D (non-particulate absorbent) containing the components shown in Table IV was then applied to the corona-treated M7Q film. The LTHC solution was applied using reverse micro-gravure coating (Yasui Seiki laboratory coater, model CAG-150). To achieve a dry thickness of approximately 1.25 microns, a line speed of 20 ft / min and a 200R microgravure printing mode set at 6.2 ft / min were used. The coating sequentially enters three ovens (75 / 75 / 80° C.) for in-line drying, and is then exposed to u...

example 3

[0147] The emissive layer of the OLED device was patterned using a Prussian blue LITI donor film as previously described in Example 2, Sample 7, comprising a radiation-cured thermal transfer element comprising 21.6% Pigment loading of Prussian blue pigment dispersed in 2.75 μm thick LTHC as imaging radiation absorbing material.

[0148] Receptor substrates were prepared on glass (0.7 mm thick) coated with ITO available from ULVAC Technologies, Inc. (Methuen, MA) under the trade designation S-ITO (150 NM). The substrate was spin coated with a Baytron P VP CH8000 (H.C. Starck Co., Newton, MA) to a dry thickness of approximately 60 nm and then heated to 200° C. for 5 minutes in a nitrogen purged oven. The coated HTM-001 (a hole-transporting polymer from Covion Organic Semiconductors GmbH (Frankfurt, Germany)) and toluene solution were then used to place it in an argon-purged glove box. The substrate was spin-coated to a dry thickness of approximately 100 nm. Finally, use standa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

Radiation curable thermal transfer elements including a substrate and a light-to-heat conversion layer overlaying the substrate, and processes to make the thermal transfer elements. The light-to-heat conversion layer is derived from a radiation curable material capable of being cured by exposure to radiation at a curing wavelength and an imaging radiation absorber material not substantially increasing radiation absorbance at the curing wavelength. The radiation curable transfer elements can be used in processes for making organic microelectronic devices.

Description

technical field [0001] The present invention relates to thermal transfer elements, particularly radiation curable thermal transfer elements that may be used in laser induced thermal imaging (LITI) processes or other imaging processes. The invention also relates to methods of making and using radiation curable heat transfer elements to fabricate organic microelectronic devices. Background technique [0002] Many tiny electronic and optical devices are made of layers of different materials laminated together. Examples of such devices include optical displays in which each pixel is formed in a patterned array, optical waveguide structures used in telecommunications devices, and metal-insulator-metal stacks used in semiconductor-based devices. Conventional methods for fabricating such devices include forming one or more layers on a receptor substrate and simultaneously or sequentially patterning the layers to form such devices. Patterning of the above-mentioned layers is often...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05B33/10
CPCB41M2205/38B41M5/46B41M2205/06Y10S430/165B41M5/465B41M5/41Y02E10/549H10K71/18H05B33/10H10K50/00
Inventor 罗宾·E·赖特卡恩·T·许恩莱斯莉·A·克莱利奇刘兰虹雷切尔·K·斯万森理查德·L·瓦尔特马丁·B·沃克斯蒂芬·A·约翰逊
Owner 3M INNOVATIVE PROPERTIES CO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com