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Producing method of lead frame cuprum alloy strip with high strength and conductivity

A technology of copper alloy strip and high lead wire is applied in the field of electronic semiconductors, which can solve the problems of long project construction period, low product yield and high operating cost, and achieve small footprint, high product yield and operating cost. low effect

Inactive Publication Date: 2008-07-23
江阴华电新材料有限公司
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  • Summary
  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

However, this method has the problems of complex procedures, large investment costs, large floor area, long project construction period, large unit energy consumption, high operating costs, and low product yield.

Method used

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  • Producing method of lead frame cuprum alloy strip with high strength and conductivity
  • Producing method of lead frame cuprum alloy strip with high strength and conductivity
  • Producing method of lead frame cuprum alloy strip with high strength and conductivity

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Embodiment Construction

[0026] The production method of the high-strength, high-guide wireframe copper alloy strip material that the present invention relates to, described method is to adopt upward drawing copper rod-continuous extrusion method, and its main process step is as follows:

[0027] Step 1. Ingredients

[0028] Chemical composition of two lead frame materials

[0029]

[0030] Among them, the content of pb and sn in C19400 shall not be greater than 0.03%,

[0031] The cathode copper, one of the raw materials required for C19400 or C19200 copper alloy materials, is fully inspected, the four sides and the particles on the four sides of the cathode copper are removed, and then dried for later use, and then the rest of the raw materials are formulated according to the chemical composition requirements, strictly To achieve the production method of one furnace and one frame,

[0032] Step 2. Upward melting and casting

[0033] Add the material described in step 1 into the submerged one-p...

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Abstract

The invention relates to a production method of a high-strength and high conductive lead frame copper alloy strip material. The main process steps comprises: batching and up melt casting; the material in the step 1 is added into a subsurface flow continuous furnace according to the formula for up melt casting; a crystallizer adopts the graphite material and dry carbon black is taken as covering agent which has the layer thickness of 80-120mm and the melt casting temperature is ranging from 1158-1218 DEG C; the extrusion is carried out continuously; a copper rod which is achieved in the step 2 is straightened and is heated to the temperature of 300-400 DEG C in an induction heating furnace; the copper rod then directly enters an extrusion concave groove; finally, a flat strip blank with the size of 12mm multiplied by 200mm is formed out of a die cavity and directly enters a cooling area which is provided with alcohol to be cooled below the temperature of 70 DEG C; the flat strip blank is coiled into coiled belts by a coiler and then handled to the next process. The method of the invention has the advantages of simple and convenient process, low investment expense, small land occupying, short construction period of the project, small unit energy consumption, low operation cost, and high yield of the products.

Description

technical field [0001] The invention relates to a production method of a high-strength, high-guide wire frame copper alloy strip. It belongs to the technical field of electronic semiconductors. Background technique [0002] Lead frame copper alloy strip is the supporting skeleton of integrated circuits and an indispensable key material for the rapid development of electronic information technology. Copper alloy strip for lead frames should have high dimensional accuracy, surface quality and performance indicators. Its conventional method is to adopt semi-continuous-hot rolling method (traditional method), and its concrete production method is as follows: [0003] Process one, smelting [0004] Raw materials such as cathode copper, iron, zinc, and phosphorus intermediate alloys that meet the process requirements are added to the low-frequency melting furnace for melting according to the formula requirements. The melting temperature is 1158 ° C ~ 1218 ° C. ~1188°C, and the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P17/00C22C9/00B22D11/16B21C23/02
Inventor 张根华
Owner 江阴华电新材料有限公司
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