Flat glass substrate attenuation etching liquid
A flat glass and etching solution technology, applied in the field of flat glass thinning etching solution, to achieve the effects of increased utilization, less volatilization, and increased etching rate
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Embodiment 1
[0018] The flat glass substrate thinning etchant includes the following components in weight percent: 5% hydrofluoric acid, 5% nitric acid, and 90% pure water.
[0019] At 25-30°C, the etching rate can reach about 3 microns / minute, the thickness uniformity after etching is less than 1%, the rate can be kept relatively stable within ±2% concentration deviation, and the utilization rate of etching solution is about 5%.
Embodiment 2
[0021] The etchant for thinning the flat glass substrate includes the following components in weight percentage: 15% of hydrofluoric acid, 10% of nitric acid, and 75% of pure water.
[0022] At 25-30°C, the etching rate can reach about 7 microns / minute, the thickness uniformity after etching is less than 2%, the rate can be kept relatively stable within ±1% concentration deviation, and the utilization rate of etching solution is about 15%.
Embodiment 3
[0024] The flat glass substrate thinning etchant includes the following composition components in weight percentage: 25% of hydrofluoric acid, 30% of nitric acid, and 45% of pure water.
[0025] At 25-30°C, the etching rate can reach about 10 microns / minute, the thickness uniformity after etching is less than 5%, the rate can be kept relatively stable within ±1% concentration deviation, and the utilization rate of etching solution is about 10%.
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