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Condensation polymer type organic silicon die plastic and preparation technique of organic silicon resin for the same

A preparation process and silicone technology are applied in the field of preparation technology of polycondensation-type silicone molding compounds and special silicone resins, which can solve the problems of high thermal shrinkage, poor adhesion, and low softening point, and improve the environment. , the effect of reducing the reaction speed and improving the compatibility

Inactive Publication Date: 2008-04-23
胡孟进
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is: to solve the technical problems that the existing silicone resin is sticky at room temperature, cracks when used as a semiconductor plastic packaging material, the thermal shrinkage rate is relatively high, the bonding performance is slightly poor, and the softening point is low. The present invention provides a polycondensation type organic silicon molding compound with high temperature resistance and arc resistance, and for this purpose, it also provides polycondensation type organic silicon molding compound with high temperature resistance and arc resistance solid sheet or amorphous powder form Preparation process of special silicone resin for silicon molding compound

Method used

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  • Condensation polymer type organic silicon die plastic and preparation technique of organic silicon resin for the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] a. Raw material composition ratio by mass

[0025] Monomethyltrichlorosilane Purity>99% 60 parts

[0026] Dimethyldichlorosilane 99.9% purity 60 parts

[0027] One-phenyltrichlorosilane Purity>99% 120 parts

[0028] Ester functional silicone coupling agent purity >99% 90 parts

[0029] b. After fully mixing the above-mentioned organosilicon monomers, add 800 parts of toluene, 1000 parts of water, and 360 parts of ethylene glycol butyl ether solvent, co-hydrolyze at a temperature of 10°C, wash with water, and add 400 parts of dihydroxydiol Phenylsilane is used as a modifier, 1.8 parts of cobalt naphthenate is used as a catalyst for polycondensation, and finally the product is obtained by desolvating under the condition of a vacuum of 1kpa, cooling and pressing into tablets.

[0030] The performance of the obtained product is suitable for molding plastics, with good heat resistance and arc resistance, but slightly higher thermal elasticity and larger expansion coeffici...

Embodiment 2

[0032] a. Raw material composition ratio by mass

[0033] Monomethyltrichlorosilane Purity>99% 120 parts

[0034] Dimethyldichlorosilane 99.9% purity 60 parts

[0035] One-phenyltrichlorosilane Purity>99% 180 parts

[0036] Diphenyldichlorosilane purity>99% 60 parts

[0037] Organosilicon monomer containing double bonds, purity > 99%, 40 parts

[0038] Acryloyl silicone macromonomer Purity>99% 160 parts

[0039] b. After fully mixing the above silicone monomers, add 1200 parts of toluene, 1800 parts of water, and 600 parts of methyl ethyl ketone solvent, co-hydrolyze at a temperature of 10°C, wash with water, and add 660 parts of bisphenol A modified silicone The oligomer is used as a modifier, and 6 parts of cobalt naphthenate is used as a catalyst for polycondensation, and finally the product is obtained by desolventizing under the condition of a vacuum of 1kpa, cooling and pressing into tablets.

[0040] The performance of the obtained product is quite good, but the cu...

Embodiment 3

[0042] a. Raw material composition ratio by mass

[0043] Monomethyltrichlorosilane Purity>99% 120 parts

[0044] Dimethyldichlorosilane 99.9% purity 60 parts

[0045] One-phenyltrichlorosilane Purity>99% 120 parts

[0046] Diphenyldichlorosilane purity>99% 60 parts

[0047] Ester functional silicone coupling agent purity >99% 100 parts

[0048]b. After fully mixing the above silicone monomers, add 800 parts of toluene, 1100 parts of water, and 500 parts of methyl ethyl ketone solvent, co-hydrolyze at a temperature of 10°C, wash with water, and add 460 parts of bisphenol A modified silicone The oligomer is used as a modifier, and 2.3 parts of cobalt naphthenate is used as a catalyst for polycondensation, and finally the product is obtained by desolventizing under the condition of a vacuum of 1kpa, cooling and pressing into tablets.

[0049] The obtained product has good performance and is suitable for making molding compounds, but it is slightly soft at room temperature.

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Abstract

The present invention relates to one kind of polycondensated silicone molding plastic and its silicone resin preparing process. The polycondensated silicone molding plastic is prepared with silicone resin, stuffing and additives, and through kneading, mixing, heating to soften, pressing and other steps. Its silicone resin is prepared with basic silicone monomer and special silicone monomer, and through mixing, dissolving in mixed solvent, low temperature co-hydrolysis, water washing, adding modifier and catalyst and polycondensation, vacuum desolvating, cooling and tabletting. The silicone resin of the present invention is superior to available silicone resin, and has high performance. The present invention may be applied in different industries.

Description

technical field [0001] The invention relates to a preparation process of polycondensation type organic silicon molding compound and special organic silicon resin. Background technique [0002] As a plastic packaging material for semiconductor components, silicone potting resins have appeared in the past. The traditional solution-type silicone resin synthesis process is adopted, and general-purpose silicone monomers are used. The specific process is as follows: figure 1 As shown, the disadvantages of this silicone resin are stickiness at room temperature, cracking in application, high heat shrinkage, slightly poor bonding performance, and low softening point. Although there have been potting compounds, heating flow, high temperature Cured, but not very well. Contents of the invention [0003] The technical problem to be solved by the present invention is: to solve the technical problems that the existing silicone resin is sticky at room temperature, cracks when used as a s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/16C08G77/60
Inventor 胡孟进王亚维
Owner 胡孟进
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