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Chemical and mechanical grinding device

A grinding device and chemical mechanical technology, applied in grinding/polishing safety devices, grinding/polishing equipment, surface polishing machine tools, etc., can solve problems such as pit-shaped defects, wafer yield decline, etc., to improve yield, Ensure cleaning and reduce the effect of pit-like defects

Inactive Publication Date: 2008-03-26
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

However, the grinding head cleaner can only clean the grinding head, but not the fixed ring on the grinding head. The abrasive and copper and copper compounds in the groove on the fixed ring will cause pits to appear on the edge of the wafer adsorbed on the grinding head. shape defects, resulting in a decrease in the yield of the wafer

Method used

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  • Chemical and mechanical grinding device
  • Chemical and mechanical grinding device
  • Chemical and mechanical grinding device

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Embodiment Construction

[0015] As shown in FIGS. 1 and 2 , the chemical mechanical polishing apparatus according to the present invention mainly includes a polishing head 1 and a polishing head cleaner 2 . The bottom surface of the polishing head 1 is constituted by the adsorption part 11 and the fixing ring 12 . The adsorption part 11 is used for adsorbing wafers (not shown) for grinding, and the fixing ring 12 is provided with a plurality of grooves 121 for discharging impurities during the grinding process.

[0016] The polishing head cleaner 2 is used for cleaning the polishing liquid and the like remaining on the wafer. The grinding head cleaner 2 includes a grinding head flusher 21, a liquid passage 22 for introducing water into the flusher 21, a control valve 23 for controlling the conduction or closing of the liquid passage 22 through a control signal, and a pressure regulating valve 24 for controlling the water pressure. . It can be seen from FIG. 1 that the length of the grinding head flu...

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Abstract

The chemico-mechanical grinder includes at least one grinding head and one grinding head cleaning device. The cleaning device includes at least one flushing unit corresponding to the grinding head and one liquid channel for guiding water to the flushing unit, and the flushing unit has length greater than the diameter of the grinding head. The cleaning device includes also one pressure regulating valve for controlling the pressure of water. The cleaning device can flush the channel in the bottom fixing ring of the grinding head easily to reduce the pit defects in the edges of the crystal chip and raise the quality of ground crystal chip. In addition, setting the pressure regulating valve in the liquid channel can reach even high flushing effect.

Description

technical field [0001] The present invention relates to a grinding device, in particular to a chemical mechanical grinding device. Background technique [0002] At present, copper is used as a metal material for interconnecting structures in integrated circuits, and a dual Damascene process is usually used to realize copper interconnections in integrated circuits. Using the dual damascene process to manufacture integrated circuit copper interconnects, after filling the copper into the wire trenches, chemical mechanical polishing (Chemical Mechanical Polish) is used to planarize the copper layer, remove the excess copper on the dielectric layer, and make the wafer surface fully flattening to facilitate subsequent thin film deposition. [0003] The chemical mechanical polishing process generally consists of three steps. The first step is used to grind off most of the metal on the wafer surface; the second step is to finely grind the metal in contact with the barrier layer by...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02H01L21/304B24B55/00
Inventor 陈肖科邢程侯柏宇
Owner SEMICON MFG INT (SHANGHAI) CORP
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