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Radiation device assembly and fastener using the same

A heat dissipation device and buckle technology, which is applied in the cooling of instruments, parts of instruments, cooling/ventilation/heating transformation, etc., can solve the problems of difficult disassembly, falling off, easy deformation under force, etc., and achieve convenient and stable assembly , easy to operate, not easy to fall off

Inactive Publication Date: 2008-03-05
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the clasp is in the shape of a sheet, which is not easy to disassemble, and is easily deformed by force and falls off from the bolt, causing short circuit or damage to other components such as circuit boards

Method used

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  • Radiation device assembly and fastener using the same
  • Radiation device assembly and fastener using the same
  • Radiation device assembly and fastener using the same

Examples

Experimental program
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Embodiment Construction

[0019] FIG. 1 is an exploded perspective view of the first embodiment of the heat dissipation device assembly of the present invention. The heat dissipation device assembly 100 includes several fasteners 10 , a radiator 20 , a fan 30 and a heat pipe 40 .

[0020] The heat sink 20 includes a base 22 and a plurality of cooling fins 24 . The fan 30 is located on one side of the base 22 . The fan 30 is a centrifugal fan. The cooling fins 24 are located at the air outlet of the fan 30 . The base 22 is made of metal materials such as copper, aluminum, aluminum alloy, etc., and the base 22 is thermally connected with a heating electronic component (not shown). Four corners of the base 22 are provided with a plurality of sleeves 222 for the fasteners 10 to pass through. Each buckle 10 includes a head 12 , an elastic body 14 and a rod 16 .

[0021] The heat pipe 40 connects the base 22 and the cooling fins 24 , and transfers the heat from the base 22 to the cooling fins 24 . The fan ...

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Abstract

A cooling device assembly and fasteners therefor, the cooling device assembly comprises a radiator and a plurality of fasteners, the radiator comprises a base, the fastener insists of a head, an elastic body and rods, the rod is provided with a stopper, the base is provided with holes corresponding with the fasteners, the edge of the hole is provided with a gap corresponding with the stopper of the rod, the elastic body is arranged between the head and the base, the rods of the fasteners and the stopper are penetrated base through the holes and gaps, then roated a certain angle to make the stopper abut to edges of the holes. The cooling device assembly of the invention has the advantages of simple operation.

Description

technical field [0001] The invention relates to a heat dissipation device combination, in particular to a heat dissipation device combination suitable for heating electronic components and a buckle used therefor. Background technique [0002] At present, with the rapid development of the computer industry, more and more heat is generated by heating electronic components such as micro-processing chips. In order to effectively dissipate the excess heat, the existing method is to attach a heat sink on the surface of the heating electronic components , and use fasteners to fix the heat sink to forcibly dissipate the heat generated by the heating electronic components. For example, Chinese Patent No. 200320123778.9 discloses a fixing structure for a heat sink. The heat sink includes a heat conducting plate and several fasteners. Each fastener includes a bolt, a spring and a buckle ring. The spring is sleeved on the bolt. On, the heat conduction plate is provided with several per...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K7/00H01L23/34G06F1/20G12B15/00
CPCH01L23/467H01L23/427H01L2023/4081H01L23/4006H01L2023/4062H01L2924/0002H01L2924/00
Inventor 胡哲诚杨志豪
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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