Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Apparatus for treating substrates

A technology for processing devices and substrates, which is used in photomechanical processing of originals, patterned surface photoengraving process, optics, etc., and can solve the problems of complicated structure, long time and cost of processing liquid, etc.

Active Publication Date: 2010-07-21
SHIBAURA MECHATRONICS CORP
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] For this reason, it is necessary to connect a drain pipe to the frame so that the treatment liquid and air bubbles are discharged from the above-mentioned liquid reservoir through the drain pipe. issues such as effort and cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Apparatus for treating substrates
  • Apparatus for treating substrates
  • Apparatus for treating substrates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0040] Figure 1 to Figure 4 Showing the first embodiment of the invention, figure 1 It is a longitudinal cross-sectional view along the width direction of the processing apparatus. This processing device includes a chamber 1 . The chamber 1 is composed of a main body 2 with an open upper surface and a cover 3 capable of opening and closing the upper surface opening of the main body 2 . One side in the width direction of the cover body 3 is rotatably connected to the above-mentioned main body 2 via a hinge 4 , and a handle (not shown) is provided on the other side in the width direction.

[0041] Support members 11 are provided on both ends in the width direction of the bottom of the main body portion 2 of the chamber 1 . A unitized conveyance device 12 is detachably provided on the pair of supporting members 11 . This carrier device 12 has a pair of base members 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a processing device for supplying the treating liquid without air bladder to basal plate. The said processing device processes the top surface of conveyed basal plate using treating liquid supplied by a treating liquid supplier. The said processing liquid supplier (31) comprises: a main stocking solution part (32) connected with a feeding liquid tube (33) for supplying the treating liquid; outflow hole (36) under the main stocking solution part to make the treating liquid outflow from the main stocking solution part; auxiliary stocking solution part (38) for storing thetreating liquid from the outflow hole; slit (44) above the auxiliary stocking solution part to supply the the treating liquid to the top surface of basal plate; a first air drawoff tube (45) communicated with the atmosphere to make the air bladder effluent from outflow hole together with the treating liquid release to the atmosphere.

Description

technical field [0001] The present invention relates to a substrate processing apparatus for supplying and processing a processing liquid on the upper surface of a substrate being conveyed in a direction intersecting with the conveying direction of the substrate. Background technique [0002] For example, in the manufacturing process of a liquid crystal display device, there is a process of forming a circuit pattern on a glass substrate. When forming a circuit pattern on a substrate, the film-formed substrate is coated with a resist and then exposed, and after exposure, it is developed with a developing solution and then etched with an etching solution. To form a circuit pattern. [0003] After the circuit pattern is formed on the substrate, organic matter such as a resist film or resist residue adhering to and remaining on the surface of the substrate is removed by a stripper. After removing organic matter with a stripping solution, the surface of the substrate is cleaned...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/67G03F7/26G03F7/30G02F1/13G02F1/1333
CPCG03F1/60G03F7/2041G03F7/70341H01L21/02002H01L21/0274H01L21/3046
Inventor 今冈裕一西部幸伸
Owner SHIBAURA MECHATRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products