Light solidifying/heat solidifying one-part welding resistant agent composition and printing circuit plate
A heat-curable and photo-curable technology, used in printed circuits, printed circuit manufacturing, photosensitive materials for opto-mechanical equipment, etc. Excellent storage stability and high reliability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0073] The present invention will be specifically described below by showing Examples and Comparative Examples, but the present invention is of course not limited to the following Examples. In addition, the following "parts" mean "parts by mass" unless otherwise specified.
Synthetic example 1
[0075] Add 660 g of cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-104S, soften Point 92°C, epoxy equivalent 220g / equivalent), 310.0g carbitol acetate, heated to 90°C and stirred to dissolve. Then, it was cooled to 80° C., 216 g of acrylic acid, 4.0 g of triphenylphosphine, and 1.3 g of methylhydroquinone were added, and reacted at 90 to 100° C. for 12 hours to obtain a reaction product having an acid value of 0.2 mgKOH / g. Add 273.6g tetrahydrophthalic anhydride therein, be heated to 90 ℃, react about 8 hours, until the absorption peak (1780cm -1 )disappear. To this reaction liquid, 310.0 parts of aromatic solvent IPSOL#150 manufactured by Idemitsu Petrochemical Co., Ltd. was added, diluted, and taken out. The carboxyl group-containing photosensitive resin varnish thus obtained had a nonvolatile content of 65% and an acid value of solid matter of 87.5 mgKOH / g. Hereinafter, this reaction solution is referred to as A-1-1 varnish.
Synthetic example 2
[0077] Add 660 g of cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-104S, soften Point 92°C, epoxy equivalent 220g / equivalent), 284.3g carbitol acetate, heated to 90°C and stirred to dissolve. Then, it was cooled to 80° C., 216 g of acrylic acid, 4.0 g of triphenylphosphine, and 1.3 g of methylhydroquinone were added, and reacted at 90 to 100° C. for 12 hours to obtain a reaction product having an acid value of 0.2 mgKOH / g. Add 180.0g succinic anhydride therein, be heated to 90 ℃, react about 8 hours, until the absorption peak (1780cm -1 )disappear. To this reaction liquid, 284.3 parts of aromatic solvent IPSOL#150 manufactured by Idemitsu Petrochemical Co., Ltd. was added, diluted, and taken out. The carboxyl group-containing photosensitive resin varnish thus obtained had a nonvolatile content of 65% and an acid value of solid matter of 95.5 mgKOH / g. Hereinafter, this reaction solution is referred to as A-1-2 varnish.
PUM
Property | Measurement | Unit |
---|---|---|
acid value | aaaaa | aaaaa |
acid value | aaaaa | aaaaa |
softening point | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com