Light solidifying/heat solidifying one-part welding resistant agent composition

A heat-curable and light-curable technology, applied in the field of heat-curable and heat-curable, can solve problems such as short pot life, reduced dryness to touch, poor development, etc., and achieve high reliability, cost reduction, and excellent storage stability Effect

Active Publication Date: 2010-06-02
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there are problems in handling: the pot-life after mixing is short, within 24 hours, and between the drying process and the developing process, the carboxyl group contained in the active energy ray-curable resin of the main ingredient and the The epoxy group of the epoxy compound in the curing agent reacts slowly, which causes poor development (hot fog), etc.
Generally, in order to increase the sensitivity, it is necessary to increase the amount of low-molecular-weight photopolymerizable monomers, but when the amount of such low-molecular-weight photopolymerizable monomers is increased, there is a problem that dryness to touch is significantly reduced

Method used

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  • Light solidifying/heat solidifying one-part welding resistant agent composition
  • Light solidifying/heat solidifying one-part welding resistant agent composition
  • Light solidifying/heat solidifying one-part welding resistant agent composition

Examples

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Embodiment

[0059] Hereinafter, although an Example and a comparative example are shown and this invention is concretely demonstrated, it is needless to say that this invention is not limited to a following example. In addition, unless otherwise stated, all the following "parts" represent "parts by mass".

Synthetic example 1

[0061] Add 700.0 g of dipropylene glycol monomethyl ether as a solvent to a flask with a thermometer, a stirrer, a dropping funnel, and a reflux condenser and heat it to 110° C., and dissolve 270.0 g of methacrylic acid and 153.0 g of methyl methacrylate in 3 hours. A mixture of ester, 294.0 g of dipropylene glycol monomethyl ether, and 10.0 g of tert-butyl peroxy-2-ethylhexanoate (Perbutyl O manufactured by NOF Corporation) as a polymerization catalyst was added dropwise thereto, and further stirred at 110° C. After 3 hours, the polymerization catalyst was deactivated to obtain a copolymer resin solution. After cooling the resin solution, 390.0 g of 3,4-epoxycyclohexylmethyl acrylate (CYCLOMER A400 manufactured by DAICEL CHEMICAL INDUSTRIES, LTD.), 5.0 g of triphenylphosphine, and 1.5 g of hydroquinone monomethyl ether were added, Raise the temperature to 100°C and stir to carry out the ring-opening addition reaction of epoxy. The carboxyl group-containing photosensitive res...

Synthetic example 2

[0063] Add 500.0 g of dipropylene glycol monomethyl ether as a solvent to a flask with a thermometer, a stirrer, a dropping funnel, and a reflux condenser and heat it to 110° C., and dissolve 165.0 g of methacrylic acid and 81.6 g of methyl methacrylate in 3 hours. A mixture of ester, 120.4 g of dipropylene glycol monomethyl ether, and 6.2 g of tert-butyl peroxy-2-ethylhexanoate (Perbutyl O manufactured by NOF Corporation) as a polymerization catalyst was added dropwise, followed by stirring at 110° C. After 3 hours, the polymerization catalyst was deactivated to obtain a copolymer resin solution. After cooling the resin solution, 167.0 g of 3,4-epoxycyclohexylmethyl acrylate (CYCLOMERA400 manufactured by DAICEL CHEMICAL INDUSTRIES, LTD.), 4.0 g of triphenylphosphine, and 1.0 g of hydroquinone monomethyl ether were added, and the temperature was raised. to 100°C and stirred for the ring-opening addition reaction of epoxy. The carboxyl group-containing photosensitive resin obt...

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Abstract

The present invention provides a photo curable and heat curable liquid solder mask composition and the printed circuit board of using the composition, the composition has the advantages of excellent coating film such as heat resisting property, closing property, electroless gold plating resisting property and electrical characteristic, etc. and excellent dry tack free property and operability, andthe composition is alkali developable. The one liquid solder mask composition includes the following components: (A) a carboxylated photo sensitive resin which is gained by addition (c) compound thatis provided with a cyclic ether group and an ethylenically unsaturated ester group in one molecule and the copolymer that is formed by (a) unsaturated carboxyl acid and (b) compound containing the ethylenically unsaturated group in one molecule besides the unsaturated carboxyl acid, besides the softening point is between 130 to 200 degree centigrade; (B) a diluent; (C) a photopolymerization evocating agent; (D) a cyanuramide or the organic acid salt; and (E) an inorganic filler. The invention also provides a printed circuit board using the solder mask composition.

Description

technical field [0001] The present invention relates to an alkali-developable photocurable and heat-curable one-component solder resist composition useful for the production of printed wiring boards and a printed wiring board using the same, and more specifically, to a heat-resistant Alkali-developable photocurable and thermosetting one-component solder resist composition that is excellent in coating film properties such as adhesion, chemical plating resistance, and electrical characteristics, and excellent in dryness to the touch and workability, and its use printed circuit boards. Background technique [0002] At present, from the viewpoint of high precision and high density, the solder resist used in the manufacture of printed wiring boards is a liquid alkali developing type solder resist that forms an image by development after exposure, and heats and solidifies to form a coating film. As such an alkali-developing type solder resist using a dilute alkaline aqueous solut...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/028G03F7/004H05K1/00H05K3/00C09D11/02C09D11/03G03F7/038H05K3/28
Inventor 椎名桃子岩佐爱子二田完永野琢
Owner TAIYO HLDG CO LTD
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