Active loop heat sink device with atomizer

Abstract

This invention discloses an active loop radiation device with an atomizer including: an evaporation cavity with a first container, a second container under the first room and an atomizer isolating the two containers, a condensation cavity with a third container connected to the second container and a capillary structure set at one side of the third one and connected to the first container and working fluid filled in the active loop radiation device, which can increase radiation efficiency and reduce heat impedance.

Description

technical field [0001] The invention relates to a heat dissipation technology, in particular to a loop type heat dissipation device of an active cooling technology. Background technique [0002] With the continuous development of the electronic information industry, today's requirements for electronic products include multi-function, fast computing and miniaturization. Therefore, while continuously improving the performance of the internal devices of electronic products, the power consumption of electronic products is also getting higher and higher. LED Array) and multi-chip module package structure (Multi-Chip Module, MCM) and other devices generate heat flux (Heat flux) also increased exponentially. Therefore, how to quickly dissipate heat in the narrow space inside electronic products is the focus of attention. [0003] Taking the CPU device as an example, the existing heat dissipation design generally includes: a heat dissipation device with a vapor chamber, a heat pip...

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Problems solved by technology

[0011] However, when using this spray-cooled droplet cooling device, an external pump must be added to push the droplets out of the micro-spray holes, which will increase the overall volume and do not meet the requirements of product miniaturization

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