Photosensitive resin composition

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve problems such as defects, and achieve the effect of excellent performance and excellent hydrophobicity

Inactive Publication Date: 2007-10-24
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when banks are formed using a conventional photosensitive resin composition, since the polarity difference between the interface of the bank and the color ink, soluble organic semiconductor, and soluble conductive polymer is small, wetness occurs on the non-substrate bank. Moisture, causing undesirable problems

Method used

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  • Photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0108] (manufacture of acrylic copolymer)

[0109] In a flask with a condenser tube and a stirrer, add 6 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile), 900 parts by weight of tetrahydroxyfuran, 25 parts by weight of methacrylic acid, 25 parts by weight Parts by weight of glycidyl methacrylate, 25 parts by weight of styrene, and 25 parts by weight of methyl methacrylate were slowly stirred after nitrogen substitution. The temperature of the above reaction solution was raised to 60° C., and this temperature was maintained for 20 hours to produce a polymer solution containing an acrylic copolymer.

[0110] In order to remove unreacted monomers in the above polymer solution containing an acrylic copolymer, 100 parts by weight of the above polymer solution were precipitated with respect to 1000 parts by weight of n-hexane as a poor solvent. Then, in order to remove the solvent in which the unreacted matter was dissolved in the filtration process using a mesh, vacuum dr...

Embodiment 2

[0118] Except using the fluorine-based compound shown in the following chemical formula 2-1 instead of the fluorine-based compound shown in the chemical formula 1-1 in the above-mentioned embodiment 1, operate with the same method as the above-mentioned embodiment 1 to manufacture a photosensitive resin composition.

[0119] [chemical formula 2-1]

[0120] CF 3 (CF 2 ) 8 CH 2 Oh

Embodiment 3

[0122] Except using the fluorine-based compound shown in the following chemical formula 3 instead of the fluorine-based compound shown in the chemical formula 1-1 in the above-mentioned embodiment 1, operate with the same method as the above-mentioned embodiment 1 to manufacture a photosensitive resin combination thing.

[0123] [chemical formula 3]

[0124] CF 3 C(CF 3 ) 2 CF 2 CF(CF 3 ) CF 2 COOH

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Abstract

The invention provides a photosensitive resin with excellent sensibility, thermal endurance, chemical resistance, etc., more particular, for the composition, the film has excellent hydrophobic property so as to be adapted for forming a dike groove in an ink-jetting manner and being used in flotation-removing. The photosensitive resin composition of the invention is characterised by containing: a) acrylic copolymers, b) 1, 2-quinone diazide compounds, c) fluorin compounds represented by one structure of chemical formulas 1-5, d) solvents, wherein the a) acrylic copolymers is obtained by copolymerizing i) unsaturated carboxylic acid, unsaturated carboxylic acid anhydrides or their mixtures; ii) unsaturated compounds containing epoxy group; and iii) olefin copolymers, and then removing non-reacted monomers.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, and more specifically, the present invention relates to a photosensitive resin composition which is excellent in properties such as sensitivity, heat resistance, and chemical resistance, and more particularly, for the composition, by The film (film) has excellent hydrophobic properties and is suitable for forming banks in ink-jet (ink-jet) methods, and is also suitable for use in lift off. Background technique [0002] Conventionally, in the liquid crystal display (LCD) manufacturing process, color protective layers, electrodes, wiring, and semiconductor (semiconductor) materials are formed through photographing (photo), etching processes, and the like. [0003] Recently, as the price of displays has become cheap, inexpensive processes and materials used in the processes have been required, and all organic display (AOD: all organic display) materials for realizing flexible displays ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/012G03F7/008G03F7/004
CPCG02F1/133345G03F7/023G03F7/0233G03F7/027G03F7/033G03F7/038H01L27/1214
Inventor 吕泰勳尹赫敏李浩真尹柱豹丘冀赫郑义澈金东明崔相角申洪大李东赫金柄郁金成卓崔守延曺东镐郑大众
Owner DONGJIN SEMICHEM CO LTD
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