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Method for cleaning rubber slag and detritus for circuit board cutting tool

A technology for cutting tools and circuit boards, which is applied in the field of cleaning glue residue and debris, and can solve the problems of burr face wear, affecting the quality of the burr, and reducing the life of the burr, etc.

Inactive Publication Date: 2007-08-15
永得精密电子有限公司
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AI Technical Summary

Problems solved by technology

[0004] Although the above conventional cleaning method can complete the action of cleaning the drill, the drill is only cleaned once, so there is often glue that is not completely removed between the chip removal groove, the main cutter face and the side cutter of the drill ( SMEAR), resulting in local frictional heat generated when the drill is used, resulting in abnormal wear of the cutter face of the drill; moreover, because the chip removal groove is the main part of the chip discharge of the drill, some powder will also pass through the cutting edge The gap is discharged. Therefore, if there is glue residue attached to the gap of the cutting edge, it will rub against the hole wall when the drill is drilling, which will cause the hole wall to be rough. This will not only reduce the life of the drill, but also It will also affect the quality of the drill when drilling

Method used

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  • Method for cleaning rubber slag and detritus for circuit board cutting tool
  • Method for cleaning rubber slag and detritus for circuit board cutting tool

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Embodiment Construction

[0028] Please refer to FIG. 1 and FIG. 2 , which are schematic diagrams of the steps of the present invention and schematic diagrams of the three-dimensional appearance of the drill respectively. As shown in the figure: the present invention is a method for cleaning scum residues of circuit board cutting tools, which at least includes primary cleaning 1, secondary cleaning 2, primary cleaning 3, secondary cleaning 4, drying 5, and coloring 6 and grinding 7 and other steps can effectively remove the glue residue on the drill 8, increase the drilling and grinding life of the drill 8, the smoothness of the chip removal groove 81 and the cutting force of the drill 8, and are not easy to break Needle, so as to achieve the effect of improving the quality of the hole wall after drilling.

[0029] And the step of the method for cleaning glue residue residue of circuit board cutting tool of the present invention comprises:

[0030] One-time cleaning 1: Retrieve the used drill 8, and m...

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Abstract

The invention relates to a method for cleaning adhesive slag of circuit board cutting tool, which artificially removes the chip on used drill needle, and uses cleaning agent to clean the drill needle again, then uses ball objects to clean the drill needle via spraying sand, uses ball objects and cleaning agent to clean the needle via ultrasonic wave, dries the needle and colors, at last grinds the face of the drill needle. Therefore, the invention can effectively remove the adhesive slag on the drill needle, improve service life of drill needle, smoothness and cutting force, to improve the quality of drill hole.

Description

technical field [0001] The invention relates to a method for cleaning glue slag residues of circuit board cutting tools, in particular to a method which can effectively remove glue slag residues on drill pins and achieve the effect of improving the quality of the hole wall after drilling. Background technique [0002] Commonly used printed circuit boards need to go through processes such as drilling and molding during manufacture. Since the circuit substrate contains copper foil substrate, glass fiber cloth, film and aluminum sheet, etc., it is necessary to use a high-hardness, wear-resistant drill when drilling. When the drill is drilling, it will rotate at a high speed. High heat is generated, which makes copper foil substrate, glass fiber cloth, film and aluminum sheet and other compositions adhere to the drill due to different degrees of melting, which affects the life of the drill and the quality of drilling. [0003] Therefore, after the drill is used, the glue residu...

Claims

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Application Information

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IPC IPC(8): B23P6/00
Inventor 张卩夫
Owner 永得精密电子有限公司
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