Module power supply pin structural parts

A module power supply and pin structure technology, applied in the direction of electrical equipment structural parts, electrical components, electrical solid devices, etc., can solve problems such as poor overcurrent capability and poor mechanical connection strength, and achieve improved production efficiency and mechanical strength. , the effect of good overcurrent capability

Inactive Publication Date: 2009-12-09
YIBO POWER SUPPLY CO LTD HANGZHOU
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The full surface mount pin is opposite to the separated through-hole pin, which can effectively overcome the shortcomings of the latter, but loses its advantages. It occupies less PCB board resources, can be produced by SMT technology, and has high assembly efficiency, but it is too Relatively poor current capability, poor mechanical connection strength

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Module power supply pin structural parts
  • Module power supply pin structural parts
  • Module power supply pin structural parts

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] refer to image 3 (A), the perforated pin 101 has a first installation head 201 , a first step 202 , a V-shaped anti-tin groove 203 , a V-shaped anti-slip groove 204 , a second step 205 and a second installation head 206 . Mounting head 201 and mounting head 205 each have inverted feet to facilitate alignment and assembly. The length of mounting head 201 can be smaller than the thickness of the module power supply PCB to be suitable for SMT process production. refer to image 3 (B, C), an embodiment of the surface-mounted pin 102 , on which there is a first soldering surface 211 , a small V-shaped anti-tin groove 212 , a small V-shaped anti-slip groove 213 , a step 214 , and a mounting head 215 . refer to image 3 (D, E), another embodiment of the surface mount type pin 102, with image 3 (B) The embodiment is different in that the steps 214 and the mounting head 215 are replaced by the second soldering surface 217 to form another surface mount pin 102 - 1 . Both th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a modular power supply pin structure, which includes a perforated pin, a surface mount pin and a high temperature resistant insulating part, and is characterized in that the insulating part combines the perforated pin, surface mounted tube The pins are positioned according to the definition of the industrial standard pins of the module power supply to obtain the pin structure of the module power supply. The modular power supply pin structure of the present invention has the advantages of both fully separated perforated pins and full surface mount tube pins, and overcomes the disadvantages of both. Power supply input and output pins adopt perforated pins, which have good overcurrent capability and strong mechanical connection strength; auxiliary function pins adopt surface mount pins and occupy less printed circuit board resources; surface mount pins after plastic packaging Combined with perforated pins, the mechanical strength is enhanced. Combined with the production process of the module power supply, the module power supply pin structure 100 can be produced by the SMT process to improve production efficiency.

Description

technical field [0001] The present invention relates to modular power supplies, and more particularly to pinouts of brick-type modular power supplies having an industry standard package. Background technique [0002] The power density of the current module power supply is getting higher and higher. The improvement of power density largely depends on the progress of technology, the performance development of components, and also benefits from the improvement of heat dissipation and packaging structure. Industry standard brick power pins are usually fully split through-hole, see figure 1 ; In recent years, there are also pins that are fully surface-mounted (SMT), see figure 2 . Fully separated perforated pins have good overcurrent capability and strong mechanical connection strength, but such pins need to provide through holes for installation and occupy more printed circuit (PCB) board resources. Other electronic components cannot be installed; and such pins cannot be pr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/04H01R4/02H01R13/405H05K7/00H01L23/48
Inventor 唐钊茹彩忠
Owner YIBO POWER SUPPLY CO LTD HANGZHOU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap