Method for growing cube-texture yttrium oxide film
A cubic texture, yttrium oxide technology, applied in coating, metal material coating process, ion implantation plating, etc., can solve the problems of slow film growth rate and low sputtering yield, etc., to prevent oxidation. Effect
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Embodiment 1
[0035] The metal substrate with cubic texture is ultrasonically cleaned with acetone to remove oil, leaving no water marks or stains on the surface. Put the sample into the magnetron sputtering deposition chamber, and evacuate until the background vacuum is less than 5×10 -4 Pa. The substrate was heated up to 500°C, filled with argon to 1×10 -1 Pa; use metal yttrium as the sputtering target material, adopt DC magnetron sputtering deposition technology, sputtering power 100W, target base distance 60mm, start pre-sputtering; 20 minutes later, water vapor is introduced into the cavity to make the moisture in the cavity The partial pressure is 3×10 -3 Pa, control the total pressure in the deposition chamber to 2Pa, and start the formal sputtering deposition. After deposition, Y is obtained 2 o 3 membrane.
[0036] figure 1 Cube texture Y grown on metal NiW substrate for adopting the method of the present invention 2 o 3 X-ray diffraction theta-2theta scan, figure 2 for ...
Embodiment 2
[0038] The metal substrate with cubic texture is ultrasonically cleaned with acetone to remove oil, leaving no water marks or stains on the surface. Put the sample into the magnetron sputtering deposition chamber, and evacuate until the background vacuum is less than 5×10 -4 Pa. The substrate was heated up to 600°C, filled with argon to 3×10 -1 Pa; use metal yttrium as the sputtering target, adopt DC magnetron sputtering deposition technology, sputtering power 300W, target base distance 150mm, start pre-sputtering; 20 minutes later, water vapor is introduced into the chamber to make the water vapor in the chamber The divided voltage is 6×10 -3 Pa, control the total pressure in the deposition chamber to 1Pa, and start the formal sputtering deposition. After deposition, Y is obtained 2 o 3 membrane.
Embodiment 3
[0040] The metal substrate with cubic texture is ultrasonically cleaned with acetone to remove oil, leaving no water marks or stains on the surface. Put the sample into the magnetron sputtering deposition chamber, and evacuate until the background vacuum is less than 5×10 -4 Pa. The substrate was heated up to 700°C and filled with argon to 8×10 -1 Pa; use metal yttrium as the sputtering target, adopt DC magnetron sputtering deposition technology, sputtering power 200W, target base distance 120mm, start pre-sputtering; 20 minutes later, water vapor is introduced into the chamber to make the water vapor in the chamber The divided voltage is 1×10 -3 Pa, control the total pressure in the deposition chamber to 5Pa, and start the formal sputtering deposition. After deposition, Y is obtained 2 o 3 membrane.
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