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Optoelectronic component packaging structure having silicon substrates

A technology for optoelectronic components and packaging structures, applied in electrical components, electrical solid-state devices, circuits, etc., can solve problems such as difficulty in mass production, affecting the wavelength of the emission light source, and complex processes, and achieve the effect of simplifying the complexity of components and increasing optical effects.

Inactive Publication Date: 2009-09-23
WALSIN LIHWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since the known light emitting diode packaging structure 10 needs to form the cup-shaped base 12 first, complete the packaging by molding or potting, and then integrate the individual light emitting diode packaging structures 10 on the printed circuit board 24 by surface mounting technology, the process is complicated. Difficult to mass produce
When applied to a high-power light-emitting diode packaging structure 10, the cup-shaped substrate 12 used to carry the photoelectric element 16 will affect the wavelength of the emitted light source, brightness attenuation, and even cause problems such as element burnout due to overheating.
Due to the bulky volume of the known LED packaging structure 10 and the heat dissipation requirements of the high-power LED packaging structure 10, the size and heat dissipation efficiency of the entire LED packaging structure 10 are limited.

Method used

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  • Optoelectronic component packaging structure having silicon substrates
  • Optoelectronic component packaging structure having silicon substrates
  • Optoelectronic component packaging structure having silicon substrates

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Embodiment Construction

[0065] Please refer to image 3 and Figure 4 , image 3 is a schematic cross-sectional view of a photoelectric element packaging structure with a silicon substrate according to the first preferred embodiment of the present invention, and Figure 4 for image 3 The schematic top view of the package structure of the optoelectronic element shown. It should be noted that the drawings are for illustration purposes only and are not drawn to original scale. Such as image 3 and Figure 4 As shown, the photoelectric device packaging structure 30 includes a silicon substrate 32 , a plurality of guiding wires 34 and at least one photoelectric device 36 . The material of the silicon substrate 32 includes polysilicon, amorphous silicon or single crystal silicon, can be a square silicon chip or a circular silicon chip, and can contain integrated circuits or passive components therein. The silicon substrate 32 has an upper surface and a lower surface, and a concave cup structure 38 ...

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Abstract

The invention provides a photoelectric element packaging structure with a silicon substrate. Microelectromechanical technology or semiconductor technology is used for mass manufacturing of silicon substrates to produce diversified and precise silicon substrates. According to the characteristics of the silicon substrate itself and the configuration of the guide wires, optoelectronic components, concave cup structures, flip chip bumps and other components on the silicon substrate, the present invention can increase the optical effect, heat dissipation effect and other effects of the optoelectronic component packaging structure. The reliability of the packaging structure is improved, and the component complexity of the optoelectronic component packaging structure is simplified.

Description

technical field [0001] The invention relates to a photoelectric element packaging structure with a silicon substrate, in particular to a photoelectric element packaging structure with a silicon substrate manufactured by micro-electromechanical technology or semiconductor technology. Background technique [0002] Light-emitting diode (light-emitting diode; LED) components belong to cold light, which has the advantages of low power consumption, long component life, no need to warm up the lamp time, and fast response speed. It is easy to make extremely small or array elements according to application requirements, so light-emitting diode elements have been widely used in indicator lights and display devices of information, communication, and consumer electronics products. In addition to being used in various outdoor displays and traffic lights, light-emitting diode components also occupy a place in the automotive industry. In addition, they also have brilliant achievements in p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/492H01L23/34
CPCH01L2924/0002H01L2224/48091H01L2224/16225H01L2224/48247
Inventor 林弘毅
Owner WALSIN LIHWA
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