Low-temperature welding material

A low-temperature solder, weight percent technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems that affect the quality of capacitors and the poor ability of capacitors to withstand inrush and harmonic currents.

Inactive Publication Date: 2009-07-08
上海上电电容器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The ordinary zinc-tin alloy is used, its melting temperature is between 280 and 330°C, and the polypropylene film will be melted during welding, and the combination rate with the aluminum foil is only 70%, which affects the quality of the capacitor, and the loss tangent of the capacitor is 0.04%.
Capacitors have poor ability to withstand inrush and harmonic currents

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Weigh 60 parts of tin, 0.015 part of copper, 0.03 part of lead, 0.03 part of iron, 0.01 part of antimony, 0.01 part of arsenic, 0.005 part of aluminum, 0.005 part of bismuth, 0.003 part of nickel, 0.001 part of cadmium, and 39.891 parts of zinc.

[0022] Put zinc in the heating furnace first, control the temperature at about 400°C, add tin after melting, keep the temperature at 200°C, stir after the tin is melted, and add other metals to obtain the low-temperature solder of the present invention .

Embodiment 2

[0024] Weigh 61.991 parts of tin, 0.015 parts of copper, 0.03 parts of lead, 0.03 parts of iron, 0.01 parts of antimony, 0.01 parts of arsenic, 0.005 parts of aluminum, 0.005 parts of bismuth, 0.003 parts of nickel, 0.001 parts of cadmium, and 37.9 parts of zinc.

[0025] Put zinc in the heating furnace first, control the temperature at about 400°C, add tin after melting, keep the temperature at 200°C, stir after the tin is melted, and add other metals to obtain the low-temperature solder of the present invention .

Embodiment 3

[0027] Weigh 63 parts of tin, 0.015 part of copper, 0.03 part of lead, 0.03 part of iron, 0.01 part of antimony, 0.01 part of arsenic, 0.005 part of aluminum, 0.005 part of bismuth, 0.003 part of nickel, 0.001 part of cadmium, and 36.891 parts of zinc.

[0028] Put zinc in the heating furnace first, control the temperature at about 400°C, add tin after melting, keep the temperature at 200°C, stir after the tin is melted, and add other metals to obtain the low-temperature solder of the present invention .

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PUM

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Abstract

The invention discloses a low-temperature solder, the composition and ratio (percentage by weight) of which are: tin 60-64%, zinc 35.891-39.891%, and the balance copper, lead, iron, antimony, arsenic, aluminum, bismuth, nickel and cadmium. The low-temperature solder of the present invention has low melting temperature, no damage to polypropylene film during welding, high bonding rate with aluminum foil, small loss tangent value of capacitor, improved partial discharge performance of capacitor and ability to withstand overvoltage and large current Etc.

Description

technical field [0001] The invention relates to a solder, in particular to a low-temperature solder. Background technique [0002] At present, the components of the capacitor are in the form of protruding pole plates, using aluminum foil as the pole plate and polypropylene film as the medium. The lead-out of the pole plate is welded by a rotary soldering iron welding process. The ordinary zinc-tin alloy is used, its melting temperature is between 280 and 330°C, and the polypropylene film will be melted during welding, and the combination rate with the aluminum foil is only 70%, which affects the quality of the capacitor, and the loss tangent of the capacitor is 0.04%. . Capacitors have poor tolerance to inrush and harmonic currents. Contents of the invention [0003] In view of the deficiencies in the prior art, the object of the present invention is to provide a low-temperature solder that does not damage the polypropylene film during welding, has a high bonding rate w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
Inventor 傅胜春
Owner 上海上电电容器有限公司
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