Sputtering coating method for high-shielding thin-film against electromagnetic interference on plastic matrix

Abstract

A kind of sputter method that plating high defilade guarding against electromagnetism disturbance film on the plastic base material, it includes the following steps: Sand blast handle step, gushing in the surface of base material by using the corundum grits; cleaning step, using ultrasonic wash the outside of the base material which has done the sand blast handles; plating step ,plating a layer of cupper film in the surface of the plastic base material with the vacuum sputter method, plating a layer of silver film again, then plating a layer of copper film again to compose of the sandwich plating tier structure that 'copper + silver + copper '. Using the sputtering method in this invention, 'copper + silver + copper ' sandwich plating tier structure is benefit to reducing a unit impedance of the film, strengthening the effect that defending against the interfere of the electromagnetism, it can also form the 'copper / silver / copper / stainless steel ' plating structure at one time in a sputter, whose block effect can reach the efficacy that above 70 dB, it is benefit to improving the production effect.

Description

technical field [0001] The invention relates to a method for coating a film on the surface of a product, in particular to a physical coating method for coating a high shielding and anti-electromagnetic interference film on the surface of a plastic substrate by vacuum sputtering. Background technique [0002] Plating a characteristic and strong adhesion coating on the surface of the plastic substrate can achieve the purpose of protecting the substrate, decorating, anti-electromagnetic wave, conducting electricity or anti-reflection. Plating an electromagnetic interference (EMI, English full name for Electromagnetic Interference) protective film on the surface of a plastic substrate is one of the common and important implementations, such as figure 1 As shown, generally, a copper film 2 with a thickness of about 2.5 μm is plated on the surface of the plastic substrate 1, and its shielding effect can reach more than 70 dB. For surface anti-corrosion protection, a layer of stain...

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Problems solved by technology

However, in order to avoid plastic deformation due to high temperature during sputtering, usually the sputtering temperature should not be set higher. Due to the temperature problem of sputtering, the thickness of one sputtering needs to be controlled within 0.7 μm. The shielding effect cannot reach 70dB. For example, a copper film with a thickness of about 0.5-0.7μm can only be plated at one time, and its shielding effect can only reach 57dB. Plastic products must leave the vacuum sputtering device to cool in the atmosphere before repeated sputtering, that is, It is said that it is necessary to repeatedly enter the vacuum sputtering device and leave the cooling for at least three times to achieve a copper film with a thickness of about 2 μm so that the shielding effect can reach more than 70dB. Affect equipment output, lower production efficiency

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