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LCP substrate sputtering coating treatment against EMI coating

A substrate and sputtering technology, which is applied in the field of coating pretreatment in the sputtering method, can solve the problems of reducing the adhesion between the substrate and the film layer, long current pulse path, poor anti-EMI effect, etc., and achieve enhanced anti-EMI effect , reduce the unit impedance, enhance the effect of adhesion

Inactive Publication Date: 2007-01-17
MITAC PRECISION TECH CO LTD SHUNDE DISTRICT FOSHAN CITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the particularity of the LCP material, in the pre-coating treatment, if the LCP substrate is directly sandblasted to roughen the surface, the film layer and the substrate can be mechanically riveted in the coating. However, due to the relatively long path of the current pulse, The anti-EMI effect is relatively poor; in addition, the LCP substrate is often mixed with fibers during the molding process. In the pre-coating treatment, only sandblasting treatment is performed, but the fibers on the surface of the substrate are exposed, which reduces the quality of the substrate and the film layer. Adhesion

Method used

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  • LCP substrate sputtering coating treatment against EMI coating

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Effect test

Embodiment 1

[0030] A method for coating a LCP base material, comprising the steps of:

[0031] Sand blasting treatment step, under the air pressure of 0.02MPa, carry out sand blasting treatment to the substrate surface with 180# white corundum sand grains;

[0032] In the cleaning step, the surface of the substrate that has been sandblasted is cleaned with ultrasonic waves, and the sand particles on the surface of the substrate are washed away;

[0033] In the primer coating step, a layer of primer is sprayed on the surface of the cleaned substrate. The primer can be glossy or matte, and the thickness is controlled at 5 μm, and then cured by UV;

[0034] For the coating, a copper film with a thickness of about 0.5 μm is plated on the surface by vacuum sputtering physical coating method.

Embodiment 2

[0036] A method for coating a LCP base material, comprising the steps of:

[0037] Sand blasting treatment step, under the air pressure of 0.05MPa, carry out sand blasting treatment to the substrate surface with 180# brown corundum sand grains;

[0038] In the cleaning step, the surface of the substrate that has been sandblasted is cleaned with ultrasonic waves, and the sand particles on the surface of the substrate are washed away;

[0039] In the primer coating step, a layer of primer is applied on the surface of the cleaned substrate by dip coating. The primer can be glossy or matte, and the thickness is controlled at 20 μm, and then cured by UV;

[0040] For the coating, a copper film with a thickness of about 0.5 μm is plated on the surface by vacuum sputtering physical coating method.

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Abstract

A pretreatment method of LCP substrate before sputtering the EMI resistance coat EMI includes the following steps: sandblasting the surface with emery of 180# at the pressure of 0.02 to 0.05MP, cleaning the sandblasted surface with ultrasonic, coating the cleaned surface with a bright or non-bright basecoat of 5-20 mum and curing by UV. In this pretreatment process, a microcosmic rough surface is formed on the LCP substrate surface via sandblasting, which rivets the film to the substrate mechanically, increases the adhesive force and solves the adhesion and application problem of vacuum sputtering on LCP substrate. The basecoat not only increases the adhesion of the film, but also assures the homogeneity, decreases the unit impedance and increases the EMI resistance.

Description

technical field [0001] The invention relates to a coating method using vacuum sputtering, in particular to a coating pretreatment method in the sputtering method. Background technique [0002] Electromagnetic Compatibility (Electromagnetic Compatibility), abbreviated as EMC, means that an electronic device neither interferes with nor is not affected by other devices. Electromagnetic compatibility, like the safety we are familiar with, is one of the most important indicators of product quality. Safety concerns people and property, while electromagnetic compatibility concerns the protection of people and the environment. Electromagnetic waves will interact with electronic components to generate interference, which is called Electromagnetic Interference (EMI for short). [0003] The miniaturization of the equipment brings the source and the sensor in close proximity. This shortens the propagation path and increases the chance of interference. The miniaturization of devices ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/02C23C14/34
Inventor 吴政道覃飞祥
Owner MITAC PRECISION TECH CO LTD SHUNDE DISTRICT FOSHAN CITY
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