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White light LED packaging method

A packaging method and white light technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of ineffective conduction of phosphor layer heat, difficult control of LED light color consistency, and difficult realization of the process, so as to reduce the background The effect of reducing the loss of scattered light, improving light extraction efficiency, and improving light extraction characteristics

Inactive Publication Date: 2008-08-13
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method of remote excitation of phosphor powder improves part of the light extraction efficiency, but some of the structures proposed by them are more complicated, and the realization process is more difficult, and the heat emitted by the phosphor layer cannot be effectively conducted to the outside, resulting in large light decay. At the same time, the consistency of LED light color after packaging is difficult to control

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0041] Such as figure 2 As shown, the front-mounted chip 3 is fixed on the bottom surface of the cup-and-bowl bracket 5, reflectors 4 are placed on both sides of the cup-and-bowl bracket 5, the surface of the front-mounted chip 3 is filled with silica gel 2, and the phosphor film layer 1 is covered and fixed on the silica gel 2. The edge of the phosphor film layer 1 is in contact with the cup-and-bowl bracket 5 .

[0042] Point silver glue in the middle of the cup and bowl type support 5, and its function is to stick the chips. High power Al 2 o 3 The GaN-based blue LED front-mount chip 3 of the substrate is placed on the silver glue in the cup-and-bowl bracket 5; the peak wavelength range of the chip 3 is 460-465nm. Heat hardening and baking to harden the silver glue. Metal wires are connected to the electrodes of the chip 3 and are electrically connected to the support, so that when the current passes through the support, the LED chip can be excited to emit light. Inje...

Embodiment 2

[0048] The white light LED is packaged by the planar film coating method, and the structure diagrams of the two white light LEDs obtained are as follows: Figure 4 Shown, others are identical with embodiment 1. The obtained white light LED has better light color stability, better heat dissipation effect and light extraction efficiency than the existing white light LED.

Embodiment 3

[0050] The white light LED is packaged by the planar film coating method, and the double-layer phosphor film structure is adopted. The structure diagram of the obtained white light LED is as follows Figure 5 Shown, others are identical with embodiment 1. The obtained white light LED has better light color stability, better heat dissipation effect and light extraction efficiency than the existing white light LED. Moreover, the multi-layer fluorescent powder coating method can make the color easy to control and can improve the color rendering index.

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Abstract

This invention relates to LED field, which discloses a white light LED and its packaging method. The white light LED includes chip, frame, silicon glue, fluorescence power film and periphery parts (such as lens). Difference between the packaging structures is that the space between the fluorescence power and chip is isolated by some materials such as silicon glue, which makes the heat of the fluorescence power and chip isolate; and the fluorescence power film brim contacts with the substrate, which makes the fluorescence power's heat conduct to the exterior to avoid the gather of fluorescence power heat. The chip is fixed on the frame, the silicon glue covers on the chip directly, the designed and prepared fluorescence power film cover on the silicon glue, and the fluorescence power film contact with the cup bowl. This method improves the light producing efficiency, and improves the stability of the light color greatly, and lowers the light decline. And the packaging method is simple, which is fit for industrial production in large scale.

Description

technical field [0001] The invention relates to a packaging method of a white light LED. Background technique [0002] LED is a semiconductor light-emitting device, which is widely used as indicator light, display screen and so on. White LED is known as the fourth-generation lighting source to replace fluorescent lamps and incandescent lamps. A traditional way to form a white light LED is that a blue light or ultraviolet chip excites the phosphor powder covered on the chip, and the light emitted by the chip under electric drive stimulates the phosphor powder to produce visible light in other bands, and each part mixes colors to form white light. [0003] The LED chips that generate white light by phosphor excitation are made of III-V compound semiconductor GaN materials. Among them, the substrate material used for GaN chip is Al 2 o 3 And SiC, the chip can emit blue light, ultraviolet light or other short-wavelength light. [0004] The phosphors used to form white LEDs ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/50H01L33/52
CPCH01L2224/48091H01L2224/73265H01L2924/00014
Inventor 王钢范冰丰祁山
Owner SUN YAT SEN UNIV
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