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BGA tester on circuit board

A circuit board and integrated circuit technology, which is applied in the direction of electronic circuit testing, single semiconductor device testing, semiconductor/solid-state device testing/measurement, etc., can solve the problems of short life of spring probes, resistance problems, etc., and achieve the goal of improving test accuracy Effect

Inactive Publication Date: 2008-03-26
DELAWARE CAPITAL FORMATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To address this issue, spring probes with short strokes were introduced, however, spring probes with short strokes have a short lifespan and need to be replaced constantly
In addition, the use of spring probes in the test device to transmit test signals from the BGA to the load circuit board may also cause resistance problems

Method used

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  • BGA tester on circuit board
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  • BGA tester on circuit board

Examples

Experimental program
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Effect test

Embodiment Construction

[0014] The testing device 10 of the present invention is used to test the integrated circuit chips already mounted on the circuit board 50 . In a preferred embodiment, the testing device 10 is used for testing a ball grid array (BGA, ball grid array) chip 51 mounted on a circuit board 50 . However, the testing device 10 can also be used for testing other integrated circuit chips. For clarity, this detailed description is limited to the BGA chip 51 already mounted on the circuit board 50 .

[0015] 1, 2a, 2b generally show the testing device 10 during testing of a BGA chip 51 . The test device 10 includes an upper assembly 8 and a lower assembly 9 . When the BGA chip 51 is tested, the circuit board 50 is placed between the upper assembly 8 and the lower assembly 9 . The lower assembly 9 has several guide pins 14 extending upwards, along which the circuit board 50 with passing holes is placed until the circuit board 50 sits on the lower assembly. In particular, four guide pi...

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PUM

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Abstract

A test device for integrated circuit chip installed on the circuit board includes: one upper assembly; one lower assembly; and several guide pins extending from the upper surface of the lower assembly. The circuit board is aligned along the guide pins and installed on the lower assembly and the upper assembly is aligned along the guide pins so that the circuit board is installed between the two assembleis. A rotable shaft is set and penetrated through the upper assembly to connect the two assemblies together. A rotable knob located in the upper assembly makes the lower assembly move towards the circuit board by its rotation so as to connect the IC chip and test pins in the lower assembly. The test device may be easily installed in the circuit board to result in accurate test result.

Description

technical field [0001] The invention relates to a test device for an integrated circuit chip such as a ball grid array chip (BGA, ball grid array), in particular to a BGA tester on a circuit board. The tester (hereinafter referred to as "testing device") includes an upper assembly and a lower assembly which communicate with each other through a circuit board installed between the upper assembly and the lower assembly. The circuit board contains the BGA chip to be tested, and the electrical communication between the test device and the BGA chip is achieved by a rotational movement that causes the probing test pins of the lower assembly to linearly abut against the BGA chip. Background technique [0002] Testing of integrated circuits, such as bead grid array chips (BGAs), is accomplished using testing apparatus known in the art. A BGA test setup typically includes a housing mounted on a load circuit board that interfaces with the test electronics. The load board is usually ...

Claims

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Application Information

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IPC IPC(8): G01R1/04G01R31/26G01R31/28H01L21/66
Inventor 戴维·A·布鲁尔
Owner DELAWARE CAPITAL FORMATION
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