Electronic components and their manufacture

Abstract

A method of manufacturing an electronic component, including: forming a thermoplastic resin layer on a surface of a semiconductor substrate including a plurality of integrated circuits and a bump electrode provided on each of the integrated circuits, to bury the bump electrode; forming a conductive pattern on a surface of the thermoplastic resin layer opposite to the semiconductor substrate, and electrically connecting the conductive pattern to the bump electrode; and dividing the semiconductor substrate in units of the integrated circuits.

Description

technical field [0001] The invention relates to an electronic component and a method for manufacturing the same. Background technique [0002] In general, in various electronic devices, electronic components such as semiconductor ICs are mounted on circuit boards or the like to form part of circuits. There are various methods of mounting electronic components on a circuit board or the like. For example, the most common method is to fill the gap between the electronic component and the circuit substrate with a filling resin to seal it and mount it in a state where the bump electrodes of the electronic component are in contact with the conductive terminal pads on the circuit substrate. [0003] In addition, as a mounting method widely used in manufacture of liquid crystal display devices, etc., electronic components can be mounted using an anisotropic conductive film (ACF; Anisotropic Conductive Film). In this method, electronic components are pressed onto a glass substrate ...

AI Technical Summary

Problems solved by technology

[0005] For example, in the method of filling a filling resin between an electronic component and a circuit board, it may take a lot of effort to inject the filling resin

[0006] In addition, in the mounting method using ACF, the conductive particles must be very small when the gap between the terminals is small, resulting in a high price of ACF

[0007] In addition, in the method described in Japanese Unexamined Patent Application Publication No. 2003-124259, it may be difficult to align the bump electrodes of the IC chip with the conductive terminal pads on the circuit board.

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