Method of manufacturing chip integrated substrate

Abstract

There are provided the steps of connecting a chip component 13 to a first substrate 10 through a wire 14, providing an electrode 21 on a second substrate 20, attaching, to the first substrate 10, a molding tool 30 having a protruded portion 31 formed corresponding to an array of a bump connecting pad 12 of the first substrate 10 and a cavity 32 formed corresponding to a region in which the chip component 13 is mounted, thereby forming a first sealing resin 34 for sealing the chip component 13 and the wire 14, bonding the electrode 21 to the bump connecting pad 12 through a solder, thereby bonding the first substrate 10 to the second substrate 20, and filling a second filling resin 40 in a clearance portion between the first substrate 10 and the second substrate 20.

Description

BACKGROUND OF THE INVENTION[0001]The present invention relates to a method of manufacturing a chip integrated substrate and more particularly to a method of manufacturing a chip integrated substrate which manufactures a chip integrated substrate having a chip provided between a pair of wiring boards.[0002]At present, a performance of an electronic apparatus using a semiconductor device including a semiconductor chip has been enhanced, and it has been demanded to increase a density in the case in which a semiconductor chip is mounted on a substrate and to reduce a size and a space of the substrate mounting the semiconductor chip thereon.[0003]Therefore, there has been proposed a substrate having a semiconductor chip embedded therein, that is, a so-called chip integrated type wiring board (hereinafter referred to as a chip integrated substrate), and there have been proposed various structures for causing the semiconductor chip to include the substrate.[0004]An example of the chip inte...

AI Technical Summary

Benefits of technology

The invention provides a method of manufacturing a chip integrated substrate that can maintain high reliability even if a chip component is connected to a first substrate through a wire. The method includes steps of connecting a chip component to a first substrate through wire bonding, providing an electrode on a second substrate, attaching a molding tool to the first substrate, filling the cavity with resin to seal the chip component and wire, bonding the connecting pad to the electrode through solder, and filling the clearance portion between the substrates with resin. The use of the molding tool before bonding the connecting pad and electrode prevents wire breakage or short circuit during flux cleaning, improving the reliability of the chip integrated substrate.

Problems solved by technology

In the case in which the solder flux remains as a residue after the soldering, it causes a corrosion.

In this case, there is a problem in that the wire is broken or the wire is deformed, resulting in the generation of a short circuit between adjacent wires.

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