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Socket for electrical parts

Inactive Publication Date: 2005-06-07
ENPLAS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009]In order to solve the problems described above, an object of the present invention is to provide a socket for electrical parts, capable of improving the heat dissipation capability of a heat sink which dissipates the heat generated from an electrical part mounted on a mounting portion thereof when in contact with the electrical part, and also capable of preventing damage to the electrical part.
[0011]According to such a construction, since the heat generated from the electrical part is conducted quickly to the contacting section of the heat sink, the heat conducted to the contacting section can then be transmitted quickly into the open air from the radiating section of the heat sink, it is possible to rapidly dissipate the heat generated from the electrical part into the open air. Accordingly, it is possible to improve the heat dissipation capability of the heat sink which dissipates the heat generated from the electrical part mounted on the mounting portion, and also to prevent damage to the electrical part.
[0013]According to this construction, the flexible thermally conductive material layer improves the heat dissipation capability of the heat sink which dissipates the heat generated from the electrical part mounted on the mounting portion, and also prevents damage to the electrical part.

Problems solved by technology

Consequently, sometimes the heat generated from the IC package during the performance testing of the IC package is not conducted sufficiently to the contact surfaces of the heat sinks, and the heat cannot be dissipated effectively from the cooling fins into the open air.
Accordingly, there is a possibility that heat is accumulated inside the IC package and the socket for electrical parts, causing damage to the IC package.
Furthermore, in the conventional socket for electrical parts, there is a predetermined limit to the size of the contact surfaces of the heat sinks that dissipate the heat generated from the IC package into the open air.
Consequently, there is a possibility that heat accumulates inside the IC package and the socket for electrical parts, causing damage to the IC package.

Method used

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Examples

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second embodiment

[0047]FIG. 8 is a side view showing the present invention. The heat sinks 7 according to this embodiment have a three-layered construction obtained by joining together the radiating section 25 formed from a lightweight material such as aluminum, and a thermal conduction member 27 that serves as the contacting section and is formed by processing a material layer with the thermal conductivity higher than that of the radiating section 25, such as a sheet of copper, via a joining material layer 28 serving as a joining section. Consequently, during performance testing of the IC package 40, the heat generated from heat generating location 42 of the IC package 40 is conducted sufficiently to the pedestal surface 24, and then can be conducted efficiently to the radiating section 25 via both the thermal conduction member 27, which is the material layer with the high thermal conductivity joined to the radiating section 25, and the joining material layer 28. The heat conducted to the radiating...

third embodiment

[0051]FIG. 10 is a side view showing the present invention. In this embodiment, heat conduction sheets 29 are disposed on both of the pedestal surfaces 24 each of which applies a pressure to the IC package 40 when the heat sinks 7 are in contact with the IC package 40. These heat conduction sheets 29, each of which is formed from a flexible heat conduction material, and contacts an upper surface of the IC package 40 when the heat sinks 7 are closed to conduct heat generated from the IC package 40 to the pedestal surfaces 24 of the heat sinks 7, closely contact the surface of the IC package 40 without leaving gaps, due to its flexibility. Consequently, gaps formed by the irregularities (swelling and surface roughness and the like) in the surfaces of the heat sinks 7 and the surface of the IC package 40 can be prevented from occurring at a joint surface when the pedestal surface 24 is in direct contact with the upper surface of the IC package 40. Accordingly, it is possible to reduce ...

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PUM

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Abstract

A socket for electrical parts, which detachably holds an electrical part such as an IC package on a mounting portion thereof and connects the electrical part electrically to external circuit, capable of improving the heat dissipation capability of a heat sink which dissipates the heat generated from the electrical part, in a state of being in contact with the electrical part mounted on the mounting portion, and also capable of preventing damage to the electrical part.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a socket for electrical parts, which detachably holds an electrical part such as an IC package on a mounting portion thereof and connects the electrical part electrically to an external circuit, and more particularly, relates to a socket for electrical parts, capable of improving the heat dissipation capability of a heat sink which dissipates the heat generated from the electrical part, when in contact with the electrical part mounted on the mounting portion, and also capable of preventing damage to the electrical part.[0003]2. Description of the Related Art[0004]Conventionally, in the testing of the performance of electrical parts such as a BGA type IC package for example, a socket is used for electrical parts, which detachably holds an electrical part on a mounting portion thereof and electrically connects the electrical part to an external measuring apparatus such as a circuit. A conv...

Claims

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Application Information

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IPC IPC(8): H05K7/12H05K7/10
CPCH05K7/12H05K7/1061
Inventor TAKAYAMA, NAOAKIMIYAZAKI, HIROSHI
Owner ENPLAS CORP
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