Growth method of dendritic crystal structure that provides directional heat transfer

Abstract

A growth method of dendritic crystal structure that provides directional heat transfer, including the steps: A. providing a substrate, whereby the substrate is provided with a plurality of crystal defects; B. depositing a plurality of metal ions on the substrate using a deposition method, whereby the metal ions on the crystal defects enable the growth of dendritic crystals. Moreover, an interspace is provided between each of the dendritic crystals. Hence, when the substrate is in contact with a heat source, heat energy is transferred from the substrate in the growth direction of the dendritic crystals; or, when the dendritic crystals are disposed at the position of a heat source, heat provided by the heat source is transferred from the dendritic crystals in a direction toward the substrate. Accordingly, the fractal structure of the dendritic crystals is used to provide ample heat dissipation areas and contact areas.

Description

BACKGROUND OF THE INVENTION[0001](a) Field of the Invention[0002]The present invention relates to a growth method of dendritic crystal structure that provides directional heat transfer, and more particularly to a method that uses a current concentration effect to achieve the growth of dendritic crystals that provide directional heat transfer. Moreover, the dendritic crystals that are formed differ from whiskers grown by extrusion using the internal stress of ductile metal.[0003](b) Description of the Prior Art[0004]Due to the current development trend for light weight and greater slimness in electronic devices, thus, how to enable heat transfer components, under the condition of smaller dimensions, achieve more rapid effective cooling of the heat produced by electronic devices is a persistent technical problem waiting to be resolved by relevant manufacturers.[0005]The majority of current common heat transfer components use copper or an aluminum substrate that have a good heat conduc...

AI Technical Summary

Benefits of technology

The present invention uses dendritic crystals for improving heat dissipation in heat transfer components. By controlling the growth and position of dendritic crystals using whiskers, the invention provides better heat dissipation efficiency. The invention also uses whiskers to create crystal defects that facilitate the growth of dendritic crystals, resulting in a more compact and secure bond to the substrate. Overall, the invention overcomes traditional prejudices toward dendritic crystals and provides better heat transfer with improved efficiency.

Problems solved by technology

Due to the current development trend for light weight and greater slimness in electronic devices, thus, how to enable heat transfer components, under the condition of smaller dimensions, achieve more rapid effective cooling of the heat produced by electronic devices is a persistent technical problem waiting to be resolved by relevant manufacturers.

However, the heat dissipation areas provided by the heat dissipating fins and the copper or aluminum substrate themselves are limited, thus it is difficult to further improve the heat dissipation efficiency of the electronic devices.

However, the aforementioned whiskers grow via release of residual internal stress in the plating, and the speed of growth using such a mechanism is not only considerably slow but also requires a comparatively longer preparation time.

Furthermore, the majority of whiskers assume rod shapes with comparatively thin diameters, and are of single crystal type, which are unable to provide a greater interfacial area.

Hence, the heat dissipation areas that such a method are able to provide is similarly limited, and the heat dissipation effect is inferior.

Furthermore, another defect commonly seen in current electroplating is dendritic crystals, and the reason why dendritic crystals are produced is because during the process of electroplating, metal ions concentrate on protruding areas due to the electric current, and such an effect influences deposit concentration on the protruding areas of the substrate, on which grow dendritic crystals.

Because such dendritic crystals seriously affect the smoothness and aesthetics of the plated elements, thus, they have always been regarded as defects that must be avoided.

. . previous studies have pointed out that problems exist in Sn—Bi plating obtained using electroplating methods including inferior adhesivity and dendritic structure growth.

Images