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Low-temperature sealing glass frit and method for preparing composite filler in glass frit

a technology of glass frit and composite filler, which is applied in the field of low-temperature sealing glass frit and the preparation of composite filler in glass frit, can solve the problems of degrading the strength of the sealing material as a whole, low and difficult control of the thermal expansion coefficient, so as to improve the yield of the packaged oled device

Active Publication Date: 2016-06-30
WUHAN TIANMA MICRO ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention relates to a low-temperature sealing glass frit and a method to prepare a composite material using this glass frit and glass powder. The glass frit can be adjusted to match the thermal expansion coefficient of the substrates used to package OLED devices, improving the yield of the packaged devices. This composite material can be used as a negative thermal expansion composite filler. The technical effect is to improve the thermal expansion match between the glass frit and the substrates, resulting in higher yield of packaged OLED devices.

Problems solved by technology

If the thermal expansion coefficient of the sealing glass frit is significantly different from the thermal expansion coefficient of the sealing glass substrates, then warping and breakage may occur when the sealing glass substrates are sealed by the sealing glass frit, or breakage may occur in the sealing glass substrates packaging the OLED device being illuminated by intensive light, thus resulting in a low yield of the packaged OLED device.
However it may be difficult to control the thermal expansion coefficient of the sealing glass frit into which such a filler and the glass powder is mixed, and micro-breakage may tend to occur at the sites where the OLED device is packaged by the sealing glass frit including the filler, thus degrading the strength of the sealing material as a whole.
Consequently, it may be difficult to control the thermal expansion coefficient of the sealing glass frit in the related art because the filler is a negative thermal expansion material, which may degrade the yield of the packaged OLED device.

Method used

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  • Low-temperature sealing glass frit and method for preparing composite filler in glass frit

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first embodiment

[0026]A low-temperature sealing glass frit according to an embodiment of the invention as illustrated in FIG. 2 includes a glass powder and a composite filler. The composite filler is a negative thermal expansion composite filler with an adjustable thermal expansion coefficient. The glass powder is typically made of one or more of V2O5, TeO2, Fe2O3, Co2O3, TiO2, ZrO2, ZnO and K2O.

[0027]The composite filler according to this embodiment is a composite material prepared from a chemical reaction of a mixture of zirconium tungstate and silicon dioxide at high temperature, where zirconium tungstate is an isotropic negative thermal expansion material, and silicon dioxide is an amorphous silicon dioxide powder material which is a zero thermal expansion material. The isotropic negative thermal expansion material being heated will shrink with cubic symmetry in all of the three crystal axles at the same shrinkage coefficient which can be adjustable uniformly as a whole in respective directions...

second embodiment

[0039]The components of the composite filler according to the first embodiment described above can be extended resulting in some other negative thermal expansion composite materials with an adjustable thermal expansion coefficient and low-temperature sealing glass frits with an adjustable thermal expansion coefficient, where the composite filler can be extended according to the components thereof at least as follows:

[0040]In a first supplementary embodiment, the composite filler is a composite filler resulting from a chemical reaction of a mixture of zirconium tungstate, silicon dioxide and cordierite at high temperature, and composite phases of the composite filler includes a zirconium tungstate and silicon dioxide composite phase, and a zirconium tungstate and cordierite composite phase.

[0041]In a second supplementary embodiment, the composite filler is a composite filler resulting from a chemical reaction of a mixture of zirconium tungstate, silicon dioxide and eucryptite at high...

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Abstract

The invention discloses a lower-temperature sealing glass frit and a method for preparing a composite filler in the glass frit. The lower-temperature sealing glass frit includes a glass powder and a negative thermal expansion composite filler with an adjustable thermal expansion coefficient. The thermal expansion coefficient of the low-temperature sealing glass frit into which the composite material and the glass powder is mixed can be adjustable so that the thermal expansion coefficient of the low-temperature sealing glass frit can match the thermal expansion coefficient of glass substrates packaging an OLED device to thereby improve the yield of the packaged OLED device.

Description

CROSS-REFERENCES TO RELATED APPLICATIONS[0001]This application claims the benefit of priority to Chinese Patent Application No. 201410838765.2, filed with the Chinese Patent Office on Dec. 26, 2014 and entitled “LOW-TEMPERATURE SEALING GLASS FRIT AND METHOD FOR PREPARING COMPOSITE FILLER IN GLASS FRIT”, the content of which is incorporated herein by reference in its entirety.BACKGROUND OF THE INVENTION[0002]In a process of fabricating an OLED display panel, in order to ensure the lifetime of an OLED device, an organic layer in the OLED device is typically insulated from vapor and oxygen in ambient air, and in the related art, an area to be sealed enclosed by an upper sealing glass substrate and a lower sealing glass substrate for packaging the OLED device is filled with a sealing glass frit (see FIG. 1), and then the sealing glass frit is heated by a moving laser beam and melted to make the OLED device airtight, where the sealing glass frit is typically a low-temperature sealing gla...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C03C8/24C08K3/36C08K3/22C03C1/00
CPCC08K2003/2258C08K2003/222C08K2003/2265C08K2003/2227C08K2003/2244C03C8/24C03C1/00C08K3/36C08K3/22C08K2003/2203C03C3/12C03C8/20
Inventor LI, DANDAN
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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