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Composite structures having improved heat aging and interlayer bond strength

a technology of interlayer bonding and composite structures, which is applied in the field of composite structures, can solve the problems of interfering with the adhesion of overmolding resin, the inability to meet high-demand applications, and the inability to impregnate fibrous materials quickly and efficiently, and achieve good long-term heat stability

Inactive Publication Date: 2012-05-03
EI DU PONT DE NEMOURS & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0018]However, there is still a need for a composite structure comprising a matrix resin composition that can rapidly and efficiently impregnate a fibrous material and wherein the composite structure exhibits good long-term heat stability.

Problems solved by technology

However, the use of a low melt viscosity polyamide composition for improving or accelerating the mixing or impregnation of fibrous materials may lead to composite structures that are not ideal for highly demanding applications such as the automotive field due to inferior mechanical and heat aging properties.
The addition of heat stabilizers to polymer matrix compositions can allow for a higher impregnation temperature which lowers the viscosity of the polymer matrix composition but these heat stabilizers can also interfere with adhesion of the overmolding resin.

Method used

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Examples

Experimental program
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Effect test

examples

[0102]The following materials were used for preparing examples (abbreviated as “E” in the table) of composites structures according to the present invention and comparative examples (abbreviated as “C” in the table) of composite structures.[0103]Polyamide 1 (PA1): polyamide comprising adipic acid and 1,6-hexamethylenediamine with a weight average molecular weight of around 32000 Daltons and is commercially available from E. I. du Pont de Nemours and Company as PA66. PA1 has a melting point of about 260° C. to about 265° C. and a glass transition of about 40° C. to about 70° C., measured by DSC Instrument first heating scan at 10° C. / min.[0104]Polyhydric alcohol based heat stabilizer (DPE): dipentaerythritol commercially available from Perstorp Speciality Chemicals AB, Perstorp, Sweden as Di-Penta 93.[0105]Copper based heat stabilizer (Cul / KI): a blend of 7-1-1 (by weight) blend of potassium iodide, cuprous iodide, and aluminum stearate, available from Ciba Specialty Chemicals.

Prepar...

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Abstract

Disclosed herein are composite structures having improved heat aging, processes for making them, and end use articles. The composite structures comprise a polyamide matrix resin composition comprising a matrix heat stabilizer ; a fibrous material and a polyamide surface resin composition comprising copper based heat stabilizer; wherein: the matrix heat stabilizer is different than the copper based heat stabilizer; and wherein the fibrous material is impregnated with the polyamide matrix resin composition.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]The present application claims the benefit of U.S. Provisional Application No. 61 / 408,166, filed Oct. 29, 2010, which is now pending, the entire disclosure of which is incorporated herein by reference; and U.S. Provisional Application Nos. 61 / 410,093, filed Nov. 4, 2010; 61 / 410,100, filed Nov. 4, 2010; 61 / 410,104, filed Nov. 4, 2010; and 61 / 410,108, filed Nov. 4, 2010; all of which are now pending, the entire disclosures of which are incorporated herein by reference.FIELD OF THE INVENTION[0002]The present invention relates to the field of composite structures having improved heat aging, processes for making them, and end use articles.BACKGROUND OF THE INVENTION[0003]With the aim of replacing metal parts for weight saving and cost reduction while having comparable or superior mechanical performance, structures based on composite materials comprising a polymer matrix containing a fibrous material have been developed. With this growing inter...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B32B5/02B32B27/04B32B27/34
CPCB32B5/024B32B2605/00B32B27/12B32B27/34B32B2260/023B32B2260/046B32B2262/101B32B2264/10B32B2264/12B32B2307/306B32B2307/308B32B2307/546C08J5/043C08J2377/06C08L77/06C08L2205/02B32B5/26B29K2077/00B29K2677/00B29K2709/08B32B2260/021C08K7/20Y10T442/2721Y10T442/674Y10T428/31623Y10T442/2762Y10T428/31725Y10T442/20Y10T442/2984Y10T442/2041Y10T428/249921Y10T428/249924Y10T442/2992Y10T428/24994Y10T442/2861Y10T428/31728Y10T442/2631B29C45/14786B29C45/0001
Inventor ELIA, ANDRI E.KIRCHNER, OLAF NORBERTWAKEMAN, MARTYN DOUGLASYUAN, SHENGMEI
Owner EI DU PONT DE NEMOURS & CO
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