High voltage recessed connector contact

Abstract

A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated.

Description

[0001]This patent application claims the benefit of U.S. provisional patent application Ser. No. 60 / 899,783 filed on Feb. 6, 2007.FIELD OF THE INVENTION[0002]The process relates to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique integrated recessed high voltage connector contact means, greatly reducing the component size, while increasing the capabilities of this type of circuitry and connection means. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage. An additional advantage in this process is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated.BACKGROUND OF THE INVENTION[0003]The standard technique of protecting high voltage circuitry from the environment and from internal arcing, due to the necessity to violate open air constr...

AI Technical Summary

Benefits of technology

[0019]Another advantage is to use a low-pressure injection molding technique to accelerate the manufacturing process.

[0033]An alternate embodiment of encapsulating high voltage circuitry incorporating a connector contact means will have the metal saddle, conductive rubber slug contact and the integrated high voltage poke-home connector tunnel located on the opposite side of the circuit board. This design will shorten the overall length of the unit and reduce the amount of injection molding material required.

Problems solved by technology

This traditional method requires many steps and much time to complete, and is thus not well suited for high volume, low cost assembly of high voltage circuit boards.

These connectors tend to be expensive and space consuming.

Often in High Voltage work, surface mount components, suitable for high voltage operation, of a specific size and performance are not available, or if they are, they are dramatically more expensive than the conventional “thru-hole” counterpart.

This patent relates to the field of die and lead frame assembly of integrated circuits and to the encapsulation packaging using transfer-molding techniques which is a much slower process than the low pressure injection molding process and less adaptable to a rapid production.

It does not incorporate the low-pressure injection molding process, the conductive rubber slug or the integrated connection tunnel.

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