Dissipation module,flat heat column thereof and manufacturing method for flat heat column

Abstract

A manufacturing method for a flat heat column includes the steps of: providing a flat hollow tube, of which a first wick structure is disposed on the inner surface; providing at least one guiding device disposed within the flat heat tube for supporting the flat heat tube, wherein a second wick structure is disposed on the surface of the guiding device; connecting the first wick structure and the second wick structure for forming a continuous wick structure; and filling a working fluid and sealing both two ends of the flat hollow tube so as to form the flat heat column. A heat dissipation module and its flat heat column are also disclosed for applying to a heat element. The flat heat column can provide flowing path with optimum thermal conductive efficiency for the fluid therein.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This Non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 097132974 filed in Taiwan, Republic of China on Aug. 28, 2008, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]1. Field of Invention[0003]The present invention relates to a heat dissipation module and in particular to a heat dissipation module having a guiding device disposed in a hollow tube and the guiding device has a wick structure.[0004]2. Related Art[0005]Accompanying the development of the technology, the number of transistors on a same unit area of the electronic device has been increasing, and this leads to an increase in heat energy while using the electronic device. The heat pipe is a simple but very effective heat dissipation device, and it has been widely applied on various electronic heat dissipation products. The heat pipe is used to transfer the energy by the latent heat p...

AI Technical Summary

Benefits of technology

The present invention provides a flat heat column with high reliability, low cost, and high thermal conductive efficiency. The invention includes a flat hollow tube with a continuous first wick structure on its inner surface, at least one guiding device with a second wick structure on its surface, and a working fluid. The first and second wick structures form a continuous wick structure. The invention also provides a method for manufacturing the flat heat column, which simplifies the manufacturing process and allows for easy adjustment of the length of the flat heat column according to different user requirements. The flat heat column has advantages of low cost and easy customization.

Problems solved by technology

Accompanying the development of the technology, the number of transistors on a same unit area of the electronic device has been increasing, and this leads to an increase in heat energy while using the electronic device.

Since the flat heat plate is conventionally formed by welding an upper plate and a lower plate together, not only that the welding path is long and the welding reliability is low, but also that the wick structures on the upper and lower plates are not able to be continuously connected but merely connected by contacting.

Additionally, in the conventional method of welding the upper and the lower plates, since a lot of elements and a high level of mold / fixture technique are needed, the cost of the conventional method is relatively higher.

Furthermore, different molds and fixtures have to be used for the flat heat plates with different lengths, so the cost of equipment is largely increased.

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