Magnetic annealing tool heat exchange system and processes

Abstract

A heat exchange system and processes for a magnetic annealing tool is provided. The system includes a process chamber housing workpieces to be processed; an element chamber partly surrounding the periphery of the process chamber, at least one means for drawing a vacuum in fluid communication with the process chamber and separately with the element chamber in order to apply a vacuum to either or both of the process and element chamber so as to promote radiation heating of the workpieces; at least one supply of fluid in communication with the process chamber and separately with the element chamber to supply a cooling gas so as to promote conductive cooling of the workpieces; a cooling chamber disposed to surround the element chamber; and means for generating a magnetic field disposed on the outer periphery of the cooling chamber.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a magnetic annealing tool heat exchange system which reduces the manufacturing cycle for the workpieces processed therein. The system provides an efficient heating and cooling cycle, as well as flexibility, as various components of the system can be independently controlled, depending on the process performed. [0003] 2. Description of Related Art [0004] Magnetic annealing is one of three processes that are required to manufacture a Magneto Resistive Random Access Memory (MRAM) chip on a standard Complementary Metal Oxide Semiconductor (CMOS). To successfully anneal an MRAM wafer, the ferromagnetic layer must be held at a predetermined temperature in a magnetic field for a period of time long enough for the crystals to orient themselves in a common direction upon cooling. The process, which is also referred to as “soak” is carried out in an inert, reducing or vacuum environment to pre...

AI Technical Summary

Problems solved by technology

However, these process heating and cooling steps are in direct conflict with one another and, therefore deleteriously affect the annealing cycle.

During cooling the hollow space is rapidly filled with gas, causing a drop in temperature and subsequent cooling.

Some of the disadvantages associated with the related art systems is that they are not sufficiently flexible to control and vary the heating and cooling steps independently and efficiently.

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