Molded waveguides

Abstract

Chemically or biochemically active agents or other species are patterned on a substrate surface by providing a micromold having a contoured surface and forming, on a substrate surface, a chemically or biochemically active agent or fluid precursor of a structure. A chemically or biochemically active agent or fluid precursor also can be transferred from indentations in an applicator to a substrate surface. The substrate surface can be planar or non-planar. Fluid precursors of polymeric structures, inorganic ceramics and salts, and the like can be used to form patterned polymeric articles, inorganic salts and ceramics, reactive ion etch masks, etc. at the surface. The articles can be formed in a pattern including a portion having a lateral dimension of less than about 1 millimeter or smaller. The indentation pattern of the applicator can be used to transfer separate, distinct chemically or biochemically active agents or fluid precursors to separate, isolated regions of a substrate surface. Waveguide arrays, combinatorial chemical or biochemical libraris, etc. can be made. Differences in refractive index of waveguide and cladding can be created by subjecting the waveguide and cladding, made of identical prepolymeric material, to different polymerization or cross-linking conditions. Interferometers are defined by coupling arrays of waveguides, where coupling can be controlled by altering the difference in refractive index between cladding and waveguide at any desired location of the array. Alteration and refractive index can be created photochemically, chemically, or the like. Sensors also are disclosed, including biochemical sensors.

Description

RELATED APPLICATIONS [0001] This application is a divisional of U.S. patent application Ser. No. 10 / 677,103, filed Oct. 1, 2003, which is a divisional of U.S. patent application Ser. No. 09 / 634,201, filed Aug. 9, 2000 (now U.S. Pat. No. 6,660,192); which is a divisional of U.S. patent application Ser. No. 09 / 004,583, filed Jan. 8, 1998 (now U.S. Pat. No. 6,355,198); which is a continuation-in-part of U.S. application Ser. No. 08 / 616,929, filed Mar. 15, 1996 (abandoned); Ser. No. 09 / 004,583 also claim priority under 35 U.S.C. §119(e) of the benefit of co-pending U.S. provisional application Ser. No. 60 / 046,689 filed May 16, 1997, all of which are incorporated herein by reference.STATEMENT AS TO POTENTIAL RIGHTS UNDER FEDERALLY SPONSORED RESEARCH AND DEVELOPMENT [0002] Research leading to the invention disclosed and claimed herein was supported in part by the Office of Naval Research, ONR Contract No. N00014-93-I-0498, and by the National Science Foundation, NSF Grant No. PHY 9312572....

AI Technical Summary

Benefits of technology

[0040] A variety of combinations of the above-described inventive methods can be carried out, for example formation of a pattern can be carried out via capillary action, instantaneous transfer can take place to form a pattern on a surface having a lateral

Problems solved by technology

That is, with wet etching it can be difficult to etch relatively precise, vertical channels in a surface.

Thus, materials suitable for reactive ion etching masks are limited.

Many metal masks, such as gold masks, are unsuitable since the metals can sputter easily.

Such procedures can be costly.

However, problems associated with this technique include softening and deformation of the cladding or substrate under temperatures required for injection molding.

Fabrication with precision is compromised, typically.

This technique requires expensive and complicated photolithographic systems for base formation of the waveguide array, and subsequent multi-step processing is required such as removal of the polymeric film from the substrate, lamination processing, curing processing, and other processing steps.

While the above techniques represent, in some cases, useful advances in the art, many of these techniques require relatively sophisticated apparatus, are expensive, and generally consume more reactants and produce more by-products in collateral fabrication steps than is optimal, and / or lack optimal versatility in application.

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