Substrate processing apparatus

Abstract

A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning / drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning / drying processing block, a blush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus that subjects substrates to processing. [0003] 2. Description of the Background Art [0004] Substrate processing apparatuses are used to subject various types of substrates such as semiconductor substrates, substrates for liquid crystal displays, plasma displays, optical disks, magnetic disks, magneto-optical disks, and photomasks, and other substrates to various types of processing. [0005] Such a substrate processing apparatus generally subjects a single substrate to a plurality of different types of processing successively. The substrate processing apparatus as described in JP 2003-324139 A comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to the interface block as an external device separate from the sub...

AI Technical Summary

Benefits of technology

"The present invention provides a substrate processing apparatus that prevents contamination in an exposure device due to contamination at the edge of a substrate. The apparatus includes a processing section that subjects the substrate to processing, and an interface that exchanges the substrate between the processing section and the exposure device. The processing section cleans the edge of the substrate before the exposure processing using a cleaning device that rotates the substrate. A position correction device corrects the position of the substrate by holding it horizontally and rotating it. The apparatus prevents non-uniform cleaning of the substrate edge, which can lead to contamination and defects in the exposure pattern. The position correction device can be a plurality of abutting members that press the substrate in a horizontal direction to correct its position. The apparatus also includes a lifting device that raises the abutting members to prevent damage to the substrate."

Problems solved by technology

With recent increases in density and integration of devices, making finer resist patterns has become an important problem.

Therefore, making finer resist patterns has had a limitation.

Although the substrate is subjected to various types of film formation processing before the exposure processing, an edge of the substrate may, in some cases, be contaminated in the process of the film formation processing.

When the substrate is subjected to the exposure processing with the edge of the substrate thus contaminated, a lens of the exposure device may be contaminated, resulting in a defective dimension and a defective shape of an exposure pattern.

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