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Titanium-copper alloy having excellent conductivity and method of producing the same

a technology of titanium-copper alloy and excellent conductivity, which is applied in the field of titanium-copper alloys having excellent conductivity, can solve the problems of poor conductivity of conventional titanium-copper alloys, and achieve the effect of improving the conductivity of titanium-copper alloys without reducing their strength

Inactive Publication Date: 2005-11-17
JX NIPPON MINING & METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009] An object of the present invention is to improve the conductivity of the titanium-copper alloy without decreasing its strength.
[0020] According to the present invention, a copper alloy is provided having excellent strength and conductivity that can be used in small, thin electronic devices.
[0025] It is known that the conductivity is decreased when a solute element is dissolved in Cu, and known to be Ti is an element that significantly decreases conductivity (see G. Ghosh, J. Miyake, M. E. Fine, JOM, vol. 49, No. 3, March, 1997, pp. 56-60). In order to increase the conductivity of the titanium-copper alloy, it is important to deposit a sufficient amount of Ti and to reduce amount of dissolved Ti as low as possible. In other words, when the amount of the Cu—Ti intermetallic compound phase is increased, the conductivity is increased. When a fine Cu—Ti intermetallic compound phase is deposited, the material can have high strength.
[0032] IV. Increase the cold working degree prior to the aging. By cold-rolling, distortion is produced. This distortion increases the deposition rate of the Cu—Ti intermetallic compound phase.

Problems solved by technology

Thus, the conventional titanium-copper alloy has poor conductivity as low as 15% IACS, which is lower than that (20% IACS) of the high beryllium-copper alloy.

Method used

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Embodiment Construction

[0039] Using electrolytic copper as a raw material, each ingot having a width of 60 mm, a thickness of 30 mm and a composition shown in Table 1 was molded in a high frequency vacuum melting furnace, hot-rolled at 850° C. to a thickness of 8 mm, cold-rolled, and solution-treated. In the solution-treating, the ingot was heated at 800° C. for 1 min, and then cooled at a rate of approximately 1000° C. / sec. Thereafter, the ingot was cold-rolled and aged. By changing the rolling working degree prior to the aging as well as the aging conditions, the amount of the Cu—Ti intermetallic compound phase was changed. The aging temperature, the aging time, and the cooling rate were changed. After the sample was heated at a predetermined temperature for a predetermined time, the cooling rate of the sample was measured. A thermocouple was attached to the sample in order to measure the temperature. An average cooling rate from the aging temperature to 300° C. was determined.

[0040] The 0.2% proof str...

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Abstract

The present invention provides a titanium-copper alloy having high strength and excellent conductivity as a copper alloy comprising: three to four percent by mass of Ti, residual Cu, and inevitable impurities, wherein the area percentage (S(%)) of a Cu—Ti intermetallic compound phase observed in a section perpendicular to the rolling direction is represented by the following formula: S(%)≧8.1×[Ti]−17.7 where [Ti] represents the Ti content in percent by mass. A method for producing the same is also provided.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a titanium-copper alloy having excellent conductivity. [0003] 2. Description of the Related Art [0004] As electronic devices have become smaller and more light-weight, electric and electronic parts have also become smaller and more light-weight. When a connector becomes thinner and more small-pitched, a contact has a further reduced cross-sectional area. In order to compensate the decrease in contact pressure and conductivity caused by the reduced cross-sectional area, a metal material used as the contact should have high strength and conductivity. [0005] In recent years, age-hardening copper alloys have been widely used as copper alloys having high strength. A supersaturated solid solution that is solution-treated is subjected to the aging treatment, whereby finely deposited matter is uniformly dispersed into the alloy to improve its strength. [0006] Among the age-hardening copper a...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22F1/00C22F1/08
CPCC22F1/08C22C9/00
Inventor IZUMI, CHIHIROHATANO, TAKAAKI
Owner JX NIPPON MINING & METALS CO LTD
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