Socket for testing a semiconductor device and a connecting sheet used for the same

Abstract

Probes 1 for testing and outer connecting terminals 14a are electrically connected to a-test socket for semiconductor devices. In use of a connecting sheet, fabricated by an elastically deformative insulating member and electrodes 202, flexibility is given, and good electrical contacts are obtainable. Further, because the connecting sheet 2 is exchangeable, contacting capability is recovered by exchange when solder debris is adhered and deposited to increase contact resistances. Accordingly, even though there is scattering of the heights of the outer connecting terminals, good electrical contact with the probes is obtainable, and even though the solder debris of the outer connecting terminals is adhered and deposited as a result of repeated usage, tests can be continuously conducted, wherein the test socket for semiconductor devices has good maintenance capability.

Description

[0001] This application is a divisional of application Ser. No. 10 / 659,281, filed on Sep. 11, 2003, which is a continuation of application Ser. No. 09 / 686,981, filed on Oct. 17, 2000 (now abandon).FIELD OF THE INVENTION [0002] The present invention relates to a test socket used for testing electrical characteristics of semiconductor devices. DISCUSSION OF BACKGROUND [0003] In accordance with advancement of functions and miniaturization of electronic equipments, the number of outer connecting terminals of semiconductor devices are increased, a density of semiconductor device becomes high, and semiconductor packages such as a ball grid array (BGA) type, which is formed by arranging outer connecting terminals on a lower surface of a semiconductor device in a grid-like form, and a chip scale package (CSP) type are increasingly used instead of a QFP type formed by arranging outwardly drawn-out connecting terminals, or an SOP type semiconductor package. When such a semiconductor package i...

AI Technical Summary

Benefits of technology

The present invention provides a test socket for semiconductor devices that can stably and continuously realize sufficient electric contact between probes and outer connecting terminals. The test socket includes a connecting sheet with electrodes in contact with the probes and outer connecting terminals of the semiconductor device. The electrodes are in contact with the outer connecting terminals through an elastically deformative insulating member. The test socket can be used with a circuit board that transmits and receives an electric signal for testing the electric characteristics of the semiconductor device. The electrodes have protrusions and recesses that increase the distance between them. The test socket can also include a guiding member and a through hole in the connecting sheet. The technical effects of the invention are improved stability and reliability of the test socket, as well as improved accuracy and efficiency of the testing process.

Problems solved by technology

Accordingly, it is difficult to arrange the probes 1 of the conventional test socket.

Therefore, a void is caused at time of mounting the outer connecting terminals to a printed circuit board and so on by melting the outer connecting terminals in use of reflow of solder, whereby a defect of blowhole is caused.

Further, as illustrated in FIG. 18, when remains 30 of solder adheres to and are deposited on a tip of a probe, the remains are oxidized in the atmosphere, and a contact resistance is increased by a coating of an oxide film 30a, there were problems that a semiconductor device could not be tested, and a function of the socket could not be demonstrated.

Further, there were problems that a contact resistance was increased by the coating of the oxide film, the semiconductor device could not be tested, and a function of the socket could not be demonstrated.

Further, it was necessary to spend a very long time and much labor for exchanging probes, selected as having high contact resistances or connection failures out of a large number, e.g. several hundreds, of the pin-like probes arranged in a grid-like form.

There was a problem that a cost becomes very high when a socket itself was changed because a unit price of the above-mentioned pin-like probe is high.

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