Method and apparatus for polishing a substrate while washing a polishing pad of the apparatus with at least one free-flowing vertical stream of liquid
a technology of polishing pad and washing liquid, which is applied in the direction of lapping machines, manufacturing tools, and abrasive surface conditioning devices, etc., can solve the problems of constant source of defects, difficult to clean the slurry, and damage to the substrate, so as to prevent the rebounding of the washing liquid, prevent the rebounding of the slurry, and eliminate the polishing-pollutant from the polishing pad
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[0028] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.
[0029] Referring to FIG. 4, an apparatus 40 for polishing a substrate includes a polishing station 400 at which a plurality of polishing pads 410 are disposed, and a carrier supporting a plurality of carrier heads 420. Each carrier head 420 presses a substrate 430 against a polishing pad 410 whereupon a surface of the substrate 430 is polished.
[0030] More specifically, referring to FIG. 5, the polishing pad 410 is mounted on platen 460 connected to a rotary member 450. The rotary member 450 comprises a motor for rotating the polishing pad 410. That is, the polishing pad 410 is rotated while the surface of the substrate 430 is polished.
[0031] The carrier head 420 includes a vacuum chuck that grasps the substrate 430 by creating a vacuum at a side of the substrate opposite that which is to be polished. While the substrate 430 is so grasped, the carr...
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