Signal transmission plate used in an assembly package

Abstract

A signal transmission plate used in an assembly package includes at least one insulating layer, at least one layout wire layer formed on the insulating layer, and a solder mask layer formed on the layout wire layer. The solder mask layer exposes partial area of the layout wire layer at the center and peripheries of the signal transmission plate to form a plurality of die bonding pads and a plurality of wire bonding pads.

Description

[0001] This is a Divisional application claiming priority under 35 U.S.C. .sctn.120, of co-pending prior application Ser. No. 10 / 293,123 filed on Nov. 12, 2002, the disclosure of which is incorporated herein by reference.[0002] 1. Field of the Invention[0003] The invention relates to a signal transmission plate used in an assembly package.[0004] 2. Description of the Related Art[0005] During the recent years, due to the steady increase of demand of consumer electronic products, namely, cellular phones, personal digital assistants (PDAs) and digital cameras, package structures are developed toward being light in weight and small in size with short signal transmission distances. Based upon such trend, in order to save package area as well as to improve problems such as signal distortion, delay or power loss, an assembly package integrates at least one die into a same package structure by perpendicular stacking.[0006] Referring to FIG. 1, a conventional ball grid array (BGA) package 1 ...

AI Technical Summary

Benefits of technology

This approach improves signal transmission quality and speed by shortening wire transmission distances, reducing noise and impedance, and supporting high I / O pin-count devices with enhanced performance.

Problems solved by technology

Nevertheless, by using conductive wires to electrically connect I / O pins of individual die with the substrate for signal transmission, the signal transmission quality of the die may be affected by the transmission distance and the number of conductive wires.

However, the longer the transmission distance of conductive wires gets, the noise increases accordingly, and the signal distortion and hysteresis become more apparent, thereby dropping the signal transmission quality.

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