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Liquid oxidation-proof slag formation-resistant additive for lead-free solder and preparation method thereof

A lead-free solder and anti-oxidation technology, which is applied in welding equipment, metal processing equipment, welding medium, etc., can solve the problems of affecting welding quality, complex reasons, waste, etc., and achieve good anti-oxidation effect, less dosage and less slag production The effect of rate reduction

Inactive Publication Date: 2007-05-16
张海鹏
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When lead-free solder is melted first, the slag formed by the accumulation of oxide film on the liquid surface will not only cause waste, but also affect the soldering quality. The reasons for this kind of slag are complicated, and there is no effective method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Put 45kg of refined tin raw material into the crucible and heat it on the heating furnace to melt it, then cut the remaining 45kg of refined tin rod into sheet-shaped tin rods with a thickness of 0.1mm, a width of 2mm, and a length of 800mm, roll them into spherical shapes and press them into "cakes" Sprinkle 10kg of p powder raw materials evenly on the "cake-shaped" tin bar, then put it into a cylindrical mixing tube made of stainless steel with a handle and a mixing tube with evenly distributed ∮5 small holes on the bottom and cover it , Immerse in the molten liquid lead-free solder in the crucible, continuously lift the mixing cylinder up and down until the material in the cylinder melts and flows into the molten lead-free solder liquid in the crucible to mix, cool and cast into granular products.

Embodiment 2

[0020] Add 54.6kg of refined tin raw material into the crucible and heat it on the heating furnace to melt, then cut the remaining 36.4kg of refined tin rod into sheet-shaped tin rods with a thickness of 0.1mm, a width of 3mm, and a length of 700mm, roll them into spherical shapes and press them into "cakes". shape", sprinkle 9kg of p powder raw materials evenly on the "cake-shaped" tin bars, and then put them into the mixing tube with ∮5 small holes evenly distributed on the wall and bottom of the cylindrical tube made of stainless steel with handle Cover, immerse in the melted liquid lead-free solder in the crucible, continuously lift the mixing cylinder up and down until the material in the cylinder melts and flows into the melted lead-free solder liquid in the crucible, mix, cool and cast into granular products.

Embodiment 3

[0022] Put 59.8kg of refined tin raw material into the crucible and heat it on the heating furnace to melt, and then cut the remaining 32.2kg of refined tin rod into sheet-shaped tin rods with a thickness of 0.1mm, a width of 2.5mm, and a length of 600mm, roll them into spherical shapes and press them into "Pie shape", 8kg of p powder raw material is evenly sprinkled on the "pie shape" tin bar, and then put into a cylinder made of stainless steel with a handle, and there are evenly distributed ∮5 small holes on the wall and bottom of the mixture Cover the inside of the cylinder, immerse in the molten liquid lead-free solder in the crucible, continuously lift the mixing cylinder up and down until the material in the cylinder melts and flows into the melted lead-free solder liquid in the crucible to mix, cool and cast into granular products.

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PUM

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Abstract

The invention relates to a liquid leadless solder anti-oxidization anti-slag additive, and relative production, wherein it comprises Sn at 90-93% and P at 10-7%. The production comprises adding tin into pot to be fused, and cutting the left fine tin rod into sheet tin bars, coiling it into ball shape and compressing into cake; then adding phosphor powder uniformly into stainless steel mixing cylinder, sealing cover and emerging into the liquid fused liquid of pot; lifting the cylinder up and down, until the material is fused and flowed into the pot, cooling it into particles. The invention has better oxidation resistance, while the slag rate can be reduced 40-60%.

Description

technical field [0001] The invention relates to a liquid lead-free solder anti-oxidation and anti-slag additive, which belongs to welding material additives. [0002] The invention also relates to a preparation method of the additive. Background technique [0003] When lead-free solder is melted first, the slag formed by the accumulation of oxide film on the liquid surface will not only cause waste, but also affect the soldering quality. Contents of the invention [0004] The object of the present invention is to overcome the shortcomings and deficiencies of the above-mentioned prior art and provide a liquid lead-free solder anti-oxidation and anti-slag additive with anti-oxidation and anti-slag, thereby reducing solder loss and improving soldering quality. [0005] The invention also provides a preparation method of the additive. [0006] The purpose of the present invention is achieved through the following technical solutions: [0007] Liquid lead-free solder anti-ox...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C1/02
Inventor 张海鹏
Owner 张海鹏
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