Method for handling electric circuitry, and structure

Abstract

The method comprises: in the first, providing an insulated baseboard; etching a groove of circuit on the insulated baseboard; filling in a first colloid in the groove of circuit used for generating bridge-erecting action with the insulated colloid; finally, filling in a second colloid capable of generating chemical reaction with the first colloid to form a wire colloid in the groove of circuit.

Description

technical field [0001] The invention relates to a manufacturing method and structure of a conductive circuit, especially a conductive circuit of conductive colloid formed by a first colloid and a second colloid. Background technique [0002] The printed circuit board is a circuit board composed of drawing the electrical wiring connecting the circuit parts into a wiring pattern according to the circuit design, and then reproducing the electrical conductor on the insulator by the mechanical processing and surface treatment specified by the design. In other words, the printed circuit board refers to the substrate before it is equipped with electronic components. [0003] In the known printed circuit board, the conductive circuit is formed by first pasting the copper foil layer on the insulating substrate, and then using procedures such as drilling, developing and etching. [0004] However, in this known method, the insulation value between the lines is not high enough because ...

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Problems solved by technology

[0004] However, this known method is easy to cause interference between the lines because there is no good insulator between the lines, resulting in insufficient insulation value between the lines.

If the insulation value between the lines is not high enough, in order to avoid interference, the distance between the lines has to be increased, but in this way, the density of the line layout cannot be increased, and the overall volume of the finished product cannot be reduced.

Furthermore, since it is known that the copper foil is only pasted on the insulating substrate by means of an adhesive substance, it is easy to cause the copper foil attached to the insulating substrate to fall off due to a long time or other factors, thereby causing conductive line break

In addition, for the etching solution used in the production of conductive lines, it is also easy to create pollution

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