Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Hybrid multilayer circuit board and manufacture method thereof

A multi-layer circuit board and circuit technology, applied in multi-layer circuit manufacturing, printed circuit, electrical components, etc., can solve problems such as poor conduction, poor ground pattern conduction, loss of electromagnetic shielding, etc., and achieve the effect of improving flexibility

Inactive Publication Date: 2007-05-09
NIPPON MEKTRON LTD
View PDF8 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] If the conductive paint 4 forming the shielding layer is skimmed during printing, poor conduction with the ground pattern will occur, thus losing the role of electromagnetic shielding
In addition, if the paint film thickness becomes thin, the component mounting part a with a thin paint film thickness and the cable part b extending from the inner layer part will occur in the part with the aforementioned hinge structure that is frequently opened and closed. Stress is generated at the step A between the conductive material 4, and the conductive material 4 is cracked, resulting in poor conduction, and the electromagnetic shielding function will still be lost.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Hybrid multilayer circuit board and manufacture method thereof
  • Hybrid multilayer circuit board and manufacture method thereof
  • Hybrid multilayer circuit board and manufacture method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Fig. 1 shows a longitudinal sectional structure of Embodiment 1 of the present invention. In this first embodiment, the single-sided flexible circuit board 1 constituting the inner layer and the cable part has two layers, and the outer layer circuit board 3 composed of a film-based metal foil laminate is formed on the outside. There are four boards in total, and the component mounting part The structures a are connected to each other by the cable part b. This structure is formed through the steps shown in FIG. 2 described later.

[0037] As shown in FIG. 1 , if the insulating substrate 31 without the outer layer material of the metal foil is extended from the component mounting portion a to connect the component mounting portions a to each other, almost no steps are generated. Therefore, when the conductive paint is printed by the screen printing method, the paint film of the barrier layer can be formed with a more uniform thickness, so that the problem of the step A i...

Embodiment 2

[0050] 4A to 4C show the manufacturing process of Embodiment 2 of the present invention. In Example 2, the semi-additive method was used for production. First, conductive treatment is performed on the surface of an insulating substrate, then a mask pattern is formed with a plating resist layer, and a circuit is formed by electroplating, followed by a process of removing unnecessary portions of the conductive treated portion.

[0051] In this conductive treatment part, a portion of the outer layer material that exists independently through a space directly above the cable part is left to form an extremely thin conductive layer. The compliance can be improved by the thinner conductive layer.

[0052] As the conduction treatment that can be used in the present invention, an unnecessary part of the conduction treatment can be removed, and resistance to a plating bath is not required. Preferably, it is made of the same material as the circuit, generally speaking, it can be made o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present inveniton provides a hybrid multilayer circuit board and a manufacture method thereof to further enhance a bending property of a cable when a conductive layer is formed in an outside of a hybrid multilayer circuit board which extends at least one cable from a multilayer mounting part obtained by laminating an outer layer material on a circuit board serving as an inner layer and a shield layer is formed for electromagnetic wave disturbance. In the hybrid multilayer circuit board, at least one cable (b) extends from a layer except an outermost layer in a multilayer mounting part (a). The hybrid multilayer circuit board contains a shield layer for electromagnetic interference in an outside, and the shield layer (4) is arranged to have an opening gap between the shield layer and the cable at a location corresponding to the cable in the outermost layer. The hybrid multilayer circuit board has: 1) a base film (11) shared with a circuit layer of the outermost layer in the part mounting part; 2) a conductive layer 12 formed on the base film; and (3) a cover layer 13 for insulating and protecting the conductive layer.

Description

technical field [0001] The present invention relates to a circuit board used in an electronic device and a manufacturing method thereof, particularly a hybrid multilayer circuit board in which a film base metal foil laminate or an insulating The outer layer material made of permanent film forms a conductive layer on the outer part of the mixed multilayer circuit board extending from the multilayer component mounting part to at least one cable part, forming a protection against electromagnetic interference (Electromagtic Interference; hereinafter referred to as EMI). Shield. Background technique [0002] As an EMI countermeasure in a circuit board, a known method is to form a conductive layer on the surface of a substrate (Patent Document 1). [0003] On the other hand, conventionally, as a circuit board, there is a hybrid multilayer circuit board used in a hinge structure such as a notebook computer and a foldable mobile phone that is frequently opened and closed frequently...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/00H05K9/00H05K3/46
Inventor 猪濑裕昭五十岚努
Owner NIPPON MEKTRON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com