TFT LCD array substrate structure and method for forming non-comformal insulation film and use
An array substrate structure and insulating thin film technology, applied in nonlinear optics, instruments, semiconductor devices, etc., can solve the problems of thin film transistor device failure, liquid crystal display device dead pixels, etc., to reduce invisible defects and display dead pixels, reduce Development costs and usage costs, effects of relaxed dependencies
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Embodiment 1
[0047] First, as shown in FIG. 3 , a substrate 12 on which a conductive film 13 (which may be a gate electrode film or a source-drain electrode film, etc.) has been formed is provided.
[0048] Then, the aforementioned substrate 12 is placed in the plasma-enhanced chemical vapor deposition equipment. In addition to passing reactive gases such as silane, ammonia and nitrogen to the plasma-enhanced chemical vapor deposition equipment for depositing insulating films, the inert gases such as argon, Or helium, or a mixed gas of helium and hydrogen, the film is etched while the film is deposited to form a non-conformal insulating film 14 . For example, the inert gas argon is fed into the plasma, and the generated argon ions are accelerated to the surface of the substrate under the action of an electric field, and bombard the surface film, resulting in film etching while depositing the film. As shown in FIG. 3 , the insulating film 14 above the conductive film 13 forms a non-conforma...
Embodiment 2
[0050] Figures 4a to 4d show the specific fabrication process of this embodiment.
[0051] Firstly, a substrate 12 on which a conductive thin film 13 (may be a gate line and a gate electrode or a source-drain electrode, etc.) has been formed is provided.
[0052] Subsequently, the substrate 12 is placed in the plasma-enhanced chemical vapor deposition equipment, and reactive gases such as silane, ammonia, and nitrogen are introduced into the reaction chamber. After a certain period of time, a first layer of insulating film 14a with a certain thickness is deposited to stop the reaction. Gas access. Due to the inherent conformal properties of plasma enhanced chemical vapor deposition, the first insulating film 14a forms vertical steps as shown in FIG. 4a.
[0053] Next, the inert gas is fed into the plasma-enhanced chemical vapor deposition equipment, and the inert gas plasma is generated under a certain power and pressure, and the inert gas ions bombard the surface of the subs...
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