Driving chip packaging structure engaged by multilayer lug and driving chip
A technology for driving chips and bumps, which is applied to semiconductor/solid-state device components, semiconductor devices, electrical components, etc., and can solve problems that affect the strength of inner pins, inconvenience, and easy wear of probes
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[0037] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, in conjunction with the accompanying drawings and preferred embodiments, the driving chip packaging structure and the driving chip using multi-layer bump bonding proposed according to the present invention will be described below. Specific embodiments, structures, features and effects thereof are described in detail below.
[0038] Please refer to FIG. 1 and FIG. 2, which is a specific embodiment of the present invention. The driving chip package structure 100 utilizing multi-layer bump bonding includes a circuit film 110, and the circuit film 100 can be carried by a tape The tape (Tape) of packaging (TCP) or the film (Film) of chip-on-film packaging (COF) is exemplified by tape in this embodiment. The circuit film 110 includes an electrically insulating soft film body 111 and A conductive circuit layer 112, and the electrical insulation...
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