Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Reinforced film for flexible printing circuit board

A flexible printing and reinforcing film technology, applied in the direction of printed circuits, printed circuit components, and electrical components to assemble printed circuits, which can solve problems such as rising prices, warping, and difficulty in manufacturing, and achieve the effect of inhibiting interface peeling

Inactive Publication Date: 2007-01-17
NIPPON MEKTRON LTD
View PDF2 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when a heat-resistant resin film is used, there are problems such as difficulty in manufacturing, increase in price, and warpage as the thickness increases.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Reinforced film for flexible printing circuit board
  • Reinforced film for flexible printing circuit board
  • Reinforced film for flexible printing circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] figure 1 A cross-sectional structure of a heat-resistant film having a three-layer structure as Example 1 of the present invention is shown. The water vapor transmission coefficient of the heat-resistant resin film of the present invention is adjusted by mixing air bubbles into the film itself. The value of the water vapor transmission coefficient is considered to be about 30.0g / 24h·m2.

[0021] When the water vapor transmission coefficient is extremely low, water vapor does not pass through the reinforcement film but stays between the interface between the reinforcement film and the flexible printed circuit board due to a high temperature process such as a reflow process, causing interfacial peeling. The heat-resistant resin film with adjusted water vapor transmission coefficient is obtained by casting and coating a heat-resistant resin solution in which water vapor is mixed by stirring, followed by heating and drying. The produced film thickness is usually 12.5 to 2...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention aims to provide a reinforcing film for a flexible printed wiring board capable of suppressing interfacial peeling between a flexible printed wiring board and a reinforcing film that occurs in a reflow process or the like during mounting. The reinforcing film for a flexible printed wiring board according to the present invention is characterized in that it has a laminated structure made of a heat-resistant resin and includes at least one bubble-incorporated layer.

Description

technical field [0001] The present invention relates to a reinforcing film for a flexible printed circuit board used in the electronic field, in particular to a reinforcing film attached to a connection terminal portion of a flexible printed circuit board requiring a certain strength to increase strength. Background technique [0002] In recent years, along with miniaturization and high density of electronic equipment, flexible printed circuit boards in which conductive circuits are formed on flexible insulating substrates have been widely used. In this case, a flexible heat-resistant resin film is used for the insulating substrate, and reinforcements are attached to parts such as connection terminals that require strength to increase strength. [0003] Conventionally, laminates for electrical insulation such as glass-cloth-based epoxy resin laminates have been used as reinforcements. However, there are processing problems such as punching residues that are likely to occur d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/00H05K3/30
Inventor 森田亚也子关根博行鹤田隆一田中秀明
Owner NIPPON MEKTRON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com