Integrated circuit device and electronic instrument

A technology of integrated circuits and circuit blocks, applied in circuits, electrical components, electric solid devices, etc., can solve the problems of fixed display panel size and difficulty in installation

Active Publication Date: 2007-01-10
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the size of the display panel incorporated into a mobile phone etc. is almost fixed
Therefore, if a fine process is used to simply shorten the integrated circuit device of the display driver and reduce the size of the integrated circuit substrate, it will lead to problems such as difficulty in installation.

Method used

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  • Integrated circuit device and electronic instrument
  • Integrated circuit device and electronic instrument
  • Integrated circuit device and electronic instrument

Examples

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Embodiment Construction

[0071] Next, preferred embodiments of the present invention will be described in detail. The embodiments described below do not unduly limit the content of the present invention described in the claims, and not all the configurations described in this embodiment are essential requirements for solving the present invention.

[0072] 1. Comparative example

[0073] exist figure 1 (A) shows an integrated circuit device 500 as a comparative example of the present embodiment. figure 1 The integrated circuit device 500 of (A) includes a memory block MB (display data RAM) and a data drive block DB. And, memory blocks MB and data drive blocks DB are arranged along the D2 direction. In addition, the memory block MB and the data drive block DB form an ultra-flat block whose length along the D1 direction is longer than its width along the D2 direction.

[0074] Image data from the host side is written into the memory block MB. And, the data driving block DB converts the digitized im...

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PUM

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Abstract

The object of the invention is to provide a slim, thin and long integrated circuit device, and electronic equipment incorporating the same. The integrated circuit device includes first and second transistors NTr 1 and PTr 1 push-pull connected between first and second power supply lines and outputting a voltage of one of the first and second power supply lines to a connection node ND by a charge-pump operation, and a pad PD electrically connected with the connection node ND and electrically connected with a flying capacitor, to which a given voltage is applied at one end, at the other end of the flying capacitor. The pad PD is disposed in an upper layer of at least one of the first and second transistors NTr 1 and PTr 1 so that the pad PD overlaps part or the entirety of at least one of the first and second transistors NTr 1 and PTr 1.

Description

technical field [0001] The invention relates to an integrated circuit device and electronic equipment. Background technique [0002] As an integrated circuit device that drives a display panel such as a liquid crystal panel, there is a display driver (LCD driver). In this display driver, it is necessary to reduce the size of the integrated circuit substrate in order to reduce the cost. [0003] However, the size of a display panel incorporated in a mobile phone or the like is almost constant. Therefore, if the integrated circuit device of the display driver is simply shortened to reduce the size of the integrated circuit substrate by using a fine process, it will lead to problems such as difficulty in installation. [0004] Patent Document 1: JP-A-2001-222249 Contents of the invention [0005] The present invention was made in view of the above-mentioned technical problems, and an object of the present invention is to provide a thin and long integrated circuit device an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/00G09G3/20G09G3/36G09G5/36G09G5/39
Inventor 熊谷敬石山久展前川和广伊藤悟藤濑隆史唐泽纯一小平觉齐木隆行高宫浩之
Owner SEIKO EPSON CORP
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