Method of manufacturing mounting board with reflector

Abstract

A method for fabricating a mounting board with an attached reflector is provided to embody a mounting board with a reflector by preparing a mounting board and a reflector board so that the boards are attached to each other by using adhesive. A plurality of electrodes for mounting a light emitting device are prepared. An inclined surface(32) is formed on the inner wall of a through hole(31) to surround each electrode for mounting the light emitting device, and a reflector board(34) is prepared in which a reflective plating layer is formed on the inclined surface of the through hole. The mounting board is attached to the reflector board by using an adhesive layer. The reflector board is made of a print board material capable of being mechanically processed. The through hole formed in the reflector board can be formed by mechanical processing.

Description

technical field [0001] The present invention relates to a manufacturing method of a mounting substrate with a reflecting mirror, and more particularly, to a method of manufacturing a mounting substrate with a reflecting mirror composed of a glass-epoxy resin substrate on which a light-emitting element is assembled. Background technique [0002] Figure 7 Indicates a light-emitting device with high luminous efficiency that effectively reflects light emitted from a light-emitting element to the side. [0003] This light-emitting device is composed of a light-emitting element 100 , a substrate 200 , a reflector 300 , and a sealing member 400 . The light emitting element 100 is a Group III nitride compound semiconductor light emitting element. The mounting substrate 200 is an insulating substrate, and a desired wiring pattern is formed on which the light emitting element 100 is mounted. The reflector 300 is made of polyamide resin in which titanium oxide is uniformly dispersed...

AI Technical Summary

Problems solved by technology

[0009] Reflectors often use white resin with high light reflectance, so there is a problem that it is necessary to have a model for resin molding, which takes time for trial production.

[0010] In addition, since injection molding of thermoplastic resin is often used for resin molding, there is a problem that deformation such as warping occurs from high-temperature resin molding to removal from the mold.

Therefore, when the mirror is bonded to the mounting substrate, it is impossible to bond a plurality of mirrors to the mounting substrate at the same time due to the deflection.

[0011] Since molds are used for resin molding mirrors, a certain distance from adjacent mirrors is required, and the formation density of mirrors cannot be increased, and the effective utilization rate cannot be increased.

[0012] In addition, since the reflector is made of resin, and the reflow temperature when soldering the light-emitting device to the motherboard is as high as 250°C, there is also a problem that the reflector itself is deformed and defective products are produced.

Especially in the case of using lead-free solder, the reflow temperature rises, and the yield of its products also rises

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