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Film forming device

A film-forming device and film-forming area technology, applied in transportation and packaging, furnace, charge manipulation, etc., can solve difficult film-forming problems, and achieve the effects of preventing pollution, reducing waste, and reducing the amount of adhesion

Active Publication Date: 2020-05-22
ULVAC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, there is a problem that it is difficult to efficiently form a film in an apparatus that performs such a film-forming process.
[0008] In particular, in an apparatus that forms films on both sides of a substrate, the above-mentioned problems are more serious.

Method used

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Embodiment Construction

[0044] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0045] figure 1 It is a schematic configuration diagram showing the whole of an embodiment of the film forming apparatus of the present invention.

[0046] also, figure 2 is a plan view showing the basic structure of the substrate holder transport mechanism of this embodiment, image 3 It is a front view showing the main part structure of this board|substrate holder conveyance mechanism.

[0047] and then, Figure 4 (a)~ Figure 4 (c) shows the structure of the substrate holder used in this embodiment, Figure 4 (a) is a plan view, Figure 4 (b) is the front view, Figure 4 (c) is an enlarged view showing the vicinity of the shielding portion.

[0048] Such as figure 1 As shown, the film formation apparatus 1 of this embodiment has the vacuum chamber 2 which forms a single vacuum atmosphere connected to the vacuum exhaust apparatus 1a.

[0049] A co...

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Abstract

Provides a small-sized, simple-structure through-type film-forming apparatus that can efficiently form films on both sides of a substrate using multiple substrate holders. The first and second film formation regions (4, 5) for film formation on the substrate (10) held by the substrate holder (11) are provided in the vacuum chamber (2), and the projection shape with respect to the vertical plane is formed. A substrate holder conveyance mechanism that is continuously arranged in a ring to pass through the conveyance paths of the first and second film formation regions (4, 5), and conveys a plurality of substrate holders (11) along the conveyance paths in a state of being horizontal. (3). The substrate holder conveying mechanism (3) includes a plurality of driving parts that contact the driven part provided on each substrate holder (11) to push and move the substrate holder (11) in the moving direction, and the driving parts are related to the corresponding Adjacent substrate holders (11) are approached with the upstream end of the substrate holder (11) on the downstream side in the moving direction and the downstream end of the substrate holder (11) on the upstream side in the moving direction The state is conveyed in the first and second film formation areas (4, 5).

Description

technical field [0001] The present invention relates to a technique of a film forming apparatus for performing pass film formation on both surfaces of a substrate held by a substrate holder in a vacuum. Background technique [0002] Conventionally, there is known a film forming apparatus that places a plurality of substrates to be film-formed on a substrate holder such as a tray and performs pass film formation (pass film formation). [0003] In such a film forming apparatus, a substrate to be filmed is introduced (loaded) into a vacuum chamber to be held by a substrate holder, and a substrate on which film formation has been completed is removed from the substrate holder and discharged (unloaded) out of the vacuum chamber. . [0004] In the prior art, the substrate is held horizontally with its film-forming surface from the loading position to the unloading position, and each process is performed while moving along an annular transport path formed in the horizontal plane. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/56B65G49/00H01L21/677
CPCC23C14/568C23C14/564C23C14/34C23C14/50H01L21/67739B65G49/00B65G47/268C23C14/56H01L21/677H01J37/34C23C14/562
Inventor 松崎淳介高桥明久水岛优
Owner ULVAC INC
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