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Method and apparatus for measuring solid interface contact heat exchange coefficient

A heat transfer coefficient and solid interface technology, applied in the field of plastic processing research, can solve problems such as large measurement errors, unintuitive data collection and processing, and low measurement temperature of measuring equipment

Inactive Publication Date: 2010-05-12
DALIAN UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] Existing measurement methods have relatively large measurement errors, relatively low measurement temperature of measurement equipment, and insufficient intuition for data collection and processing.

Method used

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  • Method and apparatus for measuring solid interface contact heat exchange coefficient
  • Method and apparatus for measuring solid interface contact heat exchange coefficient
  • Method and apparatus for measuring solid interface contact heat exchange coefficient

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Embodiment Construction

[0034] The material of the first sample 13 is 7050 extruded aluminum alloy, the material of the second sample 15 is 5CrMnMo die steel, the diameter of the sample is: Φ20, the length is: 50mm, and the measurement is carried out under the condition that the contact surface pressure is 1740N. For the contact heat transfer coefficients when the temperature of the heating furnace 11 is 300°C, 400°C, 500°C, and 600°C, a sheet 14 of the same material as that of the first sample 13 and the second sample 15 is added between the contact surfaces , the stacking of the slices 14 is alternate stacking, the surface state of the slices 14 is the same as the surface state of the sample, the same surface state includes: the same surface roughness, the same intermediate medium, etc., here the surface of the sample and the slice 14 is polished by sandpaper , the sandblasting treatment makes the sample and the sheet 14 have the same surface roughness, the number of the sheet 14 is 6, and the purpo...

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Abstract

Disclosed are a method and a device for measuring contact heat transfer coefficient on the solid interface. The method comprises connecting heating bar 12, the first sample 13, thin slice 14, the second sample 15, cold-trim bar 9, centring steel ball 16, pressure device 3 in sequence; adding corresponding thin slice 14 between the contacting surface of the two samples; increasing the number of contacting surface and enlarging temperature difference of the contacting surface; connecting the input terminals of thermal couple 4 and temperature control meter 5, and parallel the output terminal ofthe temperature control meter 5 with the industrial control machine 7 via the RS232 converter; heating the heating bar 12 with the heating stove 11, adding an asbestos heat insulating layer 10 aroundthe sample to insulate heat; the industrial control machine 7 collecting temperature signal via the temperature control meter 5, displaying and analyzing.

Description

technical field [0001] The invention belongs to the field of plastic processing research. It is mainly used to measure the contact heat transfer coefficient between metal and solid interfaces. Background technique [0002] In the plastic forming of metals, the heat transfer between the die and the parts directly affects the life of the dies and the forming accuracy of the parts, so the measurement of the contact heat transfer coefficient between metal interfaces has been favored by more and more scholars and precision plasticizers. The attention of forming enterprises. At present, there are not many measurements of the contact heat transfer coefficient at home and abroad, and the data in this area are quite lacking. Some scholars have studied and tested the contact heat transfer between solid interfaces and obtained certain data, but the common measurement method is Directly contact the two samples, because the temperature difference between the contact surfaces is relativ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20G01N25/18
Inventor 张立文裴继斌朱德才张国梁
Owner DALIAN UNIV OF TECH
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