Method of preparing phenolic foam insulation material via foaming at normal temp

Abstract

This invention relates to a method to produce phenolic foam heat preserving materials by ordinary-temperature foaming, is which phenol formaldehyde is adopted as raw materials and anhydrous polyethylene oxide sorbitan mono-oleate, aluminium hydroxide, pentane and composite acid curing agent are added. It has the characteristics that auxiliary agents and reinforcing modifiers can be also added in the raw materials; the ingredients added into the phenol formaldehyde raw materials have proportions as follows: 4~8 shares of polyethylene oxide sorbitan mono-oleate, 0.1~20 shares of auxiliary agents, 0.5~25 shares of reinforcing modifiers, 0~80 shares of aluminium hydroxide, 6~20 shares of pentane and 8~20 shares of composite acid curing agent, counting in 100 mass shares of phenol formaldehyde. In this invention, ordinar-temperature preparation of phenolic foam heat preserving materials above 0 deg. C can be realized. The phenolic foam heat preserving materials prepared have excellent properties; they help save energy and can be applied in spot construction, and therefore, they are promising materials.

Description

1. Technical field: [0001] The invention relates to a method for preparing a phenolic foam insulation material by foaming at normal temperature, aiming to realize foaming at a temperature above 0°C to prepare the phenolic foam insulation material without modifying the resole phenolic resin. 2. Background technology: [0002] Due to the low thermal conductivity of phenolic foam (0.018-0.032W / mk), compared with traditional thermal insulation materials such as mineral wool, rock wool, glass wool, etc. (0.034-0.043W / mk), its energy-saving and thermal insulation performance is nearly doubled. Polyurethane (PU) foam is equivalent and superior to polystyrene (PS) foam. Its energy-saving and thermal insulation performance ranks first among all thermal insulation materials. At the same time, it has flame retardant, low smoke, low toxicity, etc. Therefore, phenolic foam insulation materials have been greatly developed since the 1990s. First of all, they are valued by the military of ...

AI Technical Summary

Problems solved by technology

However, new problems have also arisen from this: ①The improvement of resin activity greatly reduces the storage stability, and generally can only be stored for 1 to 2 weeks

②The resin is severely branched, which increases the brittleness of the product and reduces the usability of the product

③The viscosity of the resin is too high, which makes the production operation difficult, and the size of the foam holes is different, which affects the appearance and thermal conductivity

Someone tried to add aluminum hydroxide, pentane, and mixed acid curing agent to prepare phenolic foam insulation material, but the expected effect was not achieved. To obtain a product with good performance, it needs to be improved.

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